| Allicdata Part #: | ATS-20A-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-20A-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20A-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal and heat sinks are a type of component used to manage heat generated from various electrical devices. The ATS-20A-117-C1-R0 is a thermal-heat sink device designed to efficiently manage heat from a number of different applications. In this article, we will discuss the application field and working principle of the ATS-20A-117-C1-R0 thermal-heat sink device.
The ATS-20A-117-C1-R0 thermal-heat sink device is designed for a wide range of applications including general-purpose power converters, environmental controllers, and aerospace applications. The device effectively removes and dissipates heat from the application in order to keep temperatures at an acceptable level. This device is also designed for high-temperature applications, with an operating temperature range of -20 to +115°C. Its high-quality aluminum alloy construction allows it to effectively manage heat even in extreme situations.
The ATS-20A-117-C1-R0 thermal-heat sink device features a two-stage cooling system, which includes a bottom heat sink and a top heat sink with finned extrusion. The two separate components work together to draw and dissipate heat away from the application. The bottom component works to absorb the heat and transfers it to the top finned heat sink by the way of a thermal interface material. The fins on the top component then dissipate the heat away, ensuring temperatures remain at the appropriate level.
In addition to its two-stage cooling system, the ATS-20A-117-C1-R0 also features a fin pitch of 5.1 mm and fin height of 21.4 mm, giving it a wide range of thermal conductivity. This helps to ensure that the device can effectively manage heat in a variety of scenarios. The device also features a 3-pin fan connector, allowing for easy fan connection and control.
The ATS-20A-117-C1-R0 thermal-heat sink device is also highly efficient, providing excellent thermal performance while still being highly cost-effective. The device is small enough to fit into most applications but also large enough to provide reliable heat management. It is also highly durable, with a lifespan of more than 50,000 hours.
The ATS-20A-117-C1-R0 thermal-heat sink device is a high-quality, reliable, and cost-effective way to manage heat from a variety of applications. Its two-stage cooling system provides excellent thermal performance while its wide range of thermal conductivity ensures it can efficiently manage heat in a variety of scenarios. In addition, its 3-pin fan connector and small size make it easy to install and reliable in operation.
The specific data is subject to PDF, and the above content is for reference