| Allicdata Part #: | ATS-20A-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-20A-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20A-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an important cooling system component used in a variety of applications. Some of the most common applications are computers, telecommunications, and automotive. Heat sinks are designed to remove heat from electronic components and dissipate it away from the system. The ATS-20A-12-C3-R0 heat sink is an ideal solution for applications that require high performance cooling in a small form factor.
The ATS-20A-12-C3-R0 is a radial fin heat sink with pin fin array technology. The body of the heat sink is constructed from aluminum and the fins are constructed of copper. The copper provides superior conductivity and the aluminum provides a higher degree of strength and stability. The pin fin array provides an enhanced surface area, allowing the heat sink to dissipate heat more efficiently. The ATS-20A-12-C3-R0 has a compact design and is very light weight, making it an ideal solution for applications where space is limited.
The ATS-20A-12-C3-R0 is designed to provide efficient cooling in a variety of applications. It can be used to cool CPUs, GPUs, motherboards, and other electronic components. The heat sink is designed to maximize air flow, allowing it to dissipate heat quickly and maintain a low operating temperature. The heat sink also has a unique fan clip design to ensure that the fan is securely attached to the heat sink.
The working principle of the ATS-20A-12-C3-R0 is simple. Heat is generated by the components that are mounted to the heat sink. This heat is dissipated away from the component through metal fins. Air passes through the fins and absorbs heat, then passes out of the heat sink, and away from the components. This process continues until the heat sink has absorbed and dissipated enough heat and the components no longer require cooling.
The ATS-20A-12-C3-R0 heat sink is an ideal solution for applications that require efficient cooling in a small form factor. It is designed to maximize air flow and dissipate heat quickly, while providing a secure mounting solution. The heat sink is also designed to handle the high heat generated by CPUs and GPUs while ensuring that the operating temperature of the system remains low. The ATS-20A-12-C3-R0 is an ideal thermal solution for many applications.
The specific data is subject to PDF, and the above content is for reference