| Allicdata Part #: | ATS-20A-130-C1-R0-ND |
| Manufacturer Part#: |
ATS-20A-130-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20A-130-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.56265 |
| 30 +: | $ 3.36462 |
| 50 +: | $ 3.16676 |
| 100 +: | $ 2.96881 |
| 250 +: | $ 2.77089 |
| 500 +: | $ 2.57297 |
| 1000 +: | $ 2.52349 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
A heat sink is a device used to dissipate heat away from a process, such as a CPU, GPU, microcontroller, or other integrated circuit. Heat sinks are essential components in any electronic device or system, as they are used to increase the efficiency of heat dissipation and to reduce the overall temperature of the device or system. In this article, we will examine the application field and working principle of the ATS-20A-130-C1-R0 heat sink.
Application Field
The ATS-20A-130-C1-R0 is a low profile, compact, thermally-efficient heat sink designed for use with 1-4 watt cooling applications such as processors, controllers, GPUs, FPGAs, and other small-scale electronics. Its size and low profile design makes it ideal for smaller enclosures where space is tight. It is also suitable for small-scale, embedded computing applications.
The ATS-20A-130-C1-R0 has a thermal resistance of 0.45°C/W, which is suitable for applications where a faster heat dissipation is required. The device is made from high-grade aluminum, which provides excellent heat conductivity and is resistant to corrosion. It is also designed with fins, which increase the surface area to further improve heat dissipation.
The heat sink is designed to be mounted on a heatsink plate, which has a hole in the center for easy attachment. The device is also compatible with a wide range of fans, enabling it to be used in a wide range of cooling solutions.
Working Principle
The ATS-20A-130-C1-R0 works by dissipating heat away from sensitive electronics components. The heat sink features an aluminum body, which provides a low thermal resistance, allowing for effective heat distribution. The hot components inside the device are attached to the aluminum base of the heat sink and the heat is quickly transferred into the fins, as the body provides a much higher surface area than the base area.
The fins are shaped to allow for a larger surface area of contact with the aluminum body, which increases the rate at which heat is dissipated. As the fins are made from aluminum, the heat is easily pulled away from the component and into the air surrounding the device. This process allows the component to remain in an optimal temperature range and ensures that the device remains reliable and efficient.
The ATS-20A-130-C1-R0 is a compact, thermally-efficient heat sink that is suitable for small-scale, embedded computing applications.
The device is constructed from high-grade aluminum, which provides excellent heat conductivity and is resistant to corrosion. The body has a low thermal resistance, which means that heat is quickly dissipated away from the hot components and into the air surrounding the device. The fins are shaped to allow for a larger surface area of contact with the aluminum body, which further improves heat dissipation.
The device is designed to be mounted on a heat sink plate, which has a hole in the center for easy attachment. The ATS-20A-130-C1-R0 is also compatible with a wide range of fans, enabling it to be used in a range of cooling solutions. Overall, the device is an excellent choice for cooling small-scale, embedded computing applications.
The specific data is subject to PDF, and the above content is for reference