
Allicdata Part #: | ATS-20A-47-C1-R0-ND |
Manufacturer Part#: |
ATS-20A-47-C1-R0 |
Price: | $ 3.65 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X30MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.31695 |
30 +: | $ 3.22707 |
50 +: | $ 3.04781 |
100 +: | $ 2.86858 |
250 +: | $ 2.68930 |
500 +: | $ 2.59965 |
1000 +: | $ 2.33071 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.24°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-20A-47-C1-R0 is a thermal solution used for heat transfer, often used in applications that require consumer electronics to run cool and operate efficiently. It is one of the most popular solutions in the Thermal - Heat Sinks category.
The ATS-20A-47-C1-R0 is designed to dissipate heat from heat-generating electronic components, such as CPUs, GPUs, and power supply units. The solution consists of a metal base and a vertical aluminum fin structure. The base helps to evenly distribute the generated heat by forming a high-performance thermal interface between the component and the heat sink. The fins, on the other hand, are extended to effectively increase the surface area for better heat dissipation. By optimizing these design factors, the ATS-20A-47-C1-R0 is able to achieve higher thermal performance in smaller form factor products.
The ATS-20A-47-C1-R0 features a unique form factor with an optimized thermal design specifically engineered to fit into limited spaces. It offers a good balance between thermal performance and size reduction. The size efficiency and thermal performance of this heat sink solution makes it an ideal choice for applications with confined spaces.
The ATS-20A-47-C1-R0 also includes an integrated fan and vibration dampening gaskets. The fan, which is made of a durable material, is used to improve the overall thermal performance by increasing the airflow and creating a negative pressure environment, thus enhancing the heat transfer. The gaskets help minimize the effect of fan vibration and noise on the components.
The working principle of the ATS-20A-47-C1-R0 is simple yet effective. Heat is generated by the component. This heat is then transferred to the ATS-20A-47-C1-R0’s metal base and fins, where it is dissipated into the surrounding air. The integrated fan also helps to increase the airflow in the enclosure, thus further improving the heat transfer and performance.
The ATS-20A-47-C1-R0 is a versatile solution that can be used with a wide variety of components, including CPUs, GPUs, memory modules, and power supply units. It is ideal for applications in computing, mobile computing, consumer electronics, and networking systems, as it offers the best thermal performance in a compact form factor. Its optimized design makes it suitable for applications in tight spaces and for high-wattage components.
Overall, the ATS-20A-47-C1-R0 is an ideal thermal solution for applications in the Thermal - Heat Sinks category. Its unique features and design enable it to provide better thermal performance in a reduced form factor. Its integrated fan and vibration dampening gaskets help optimize thermal performance and minimize fan noise. As such, it is an excellent choice for applications ranging from consumer electronics to networking systems.
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