ATS-20A-58-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20A-58-C3-R0-ND

Manufacturer Part#:

ATS-20A-58-C3-R0

Price: $ 3.88
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20A-58-C3-R0 datasheetATS-20A-58-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.52800
30 +: $ 3.33186
50 +: $ 3.13589
100 +: $ 2.93990
250 +: $ 2.74390
500 +: $ 2.54791
1000 +: $ 2.49892
Stock 1000Can Ship Immediately
$ 3.88
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.25°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components for many electronic applications. They provide a way to dissipate the heat generated by electrical components, and can even prevent the components from becoming damaged due to heat-related issues. The ATS-20A-58-C3-R0 thermal-heat sink is a type of device that is specifically designed for superior thermal management. In this article, we’ll discuss the application field and working principle of the ATS-20A-58-C3-R0 thermal-heat sink.

The ATS-20A-58-C3-R0 thermal-heat sink is a very popular device due to its versatility. It can be used in a wide range of applications, such as HVAC systems, electronic equipment, automotive components, lasers and communications systems. The device is also suitable for use in small scale and large scale embedded systems, as well as for military and aerospace applications. The thermal-heat sink has a very efficient thermal conductivity, and is considered to be one of the best devices for thermal management.

When it comes to the application field of the ATS-20A-58-C3-R0 thermal-heat sink, one of its main uses is to dissipate heat from components and electronic systems. This type of device helps to reduce the chances of component failure due to thermal-related issues. The ATS-20A-58-C3-R0 is also used to improve the efficiency of electronics systems, as properly managed thermal-heat sinks can reduce the time it takes for components to reach their maximum temperatures. This device can also help with cooling off sensitive components and electronics.

The ATS-20A-58-C3-R0 thermal-heat sink works by dissipating the generated heat via thermal conduction through the various points of contact between the device and the electronic components or systems. This thermal conduction helps to spread the heat across a larger surface area, allowing it to dissipate more efficiently. The thermal-heat sink is also equipped with a fan, which helps to spread the heat across a greater surface area. This helps to reduce the chances of component failure due to thermal-related issues.

The ATS-20A-58-C3-R0 thermal-heat sink has a number of features that make it a great choice for many applications. For one, the device has a large surface area and is specially designed to maximize thermal transfer. It also has an efficient fan and is constructed from lightweight polymer material, which makes it extremely easy to install. Lastly, the ATS-20A-58-C3-R0 thermal-heat sink is highly durable and very reliable.

In conclusion, the ATS-20A-58-C3-R0 thermal-heat sink is a great device for thermal management. It provides an easy and reliable way to dissipate heat away from components and electronic systems, which helps to reduce the chances of component failure. The ATS-20A-58-C3-R0 thermal-heat sink is a very versatile device and can be used in a variety of applications. It’s also very easy to install and is very reliable.

The specific data is subject to PDF, and the above content is for reference

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