| Allicdata Part #: | ATS32907-ND |
| Manufacturer Part#: |
ATS-20A-72-C2-R0 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20A-72-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.95810 |
| 10 +: | $ 4.82328 |
| 25 +: | $ 4.55540 |
| 50 +: | $ 4.28740 |
| 100 +: | $ 4.01946 |
| 250 +: | $ 3.75150 |
| 500 +: | $ 3.48354 |
| 1000 +: | $ 3.41655 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are an essential part of many modern electronics. They are used to dissipate heat, allowing electronic components to run cool and efficiently. The ATS-20A-72-C2-R0 is a high-efficiency heat sink used in a variety of applications. In this article, we’ll look at the application fields and working principle of the ATS-20A-72-C2-R0.
Applications
The ATS-20A-72-C2-R0 is a low profile, aluminum extruded heat sink designed for cooling power transistors, voltage regulators, DC-DC converters, microprocessors and other high-density electronic components. It is suitable for a wide range of applications, including personal electronics, medical devices, consumer electronics, automotive electronics, power supplies and other thermal management solutions.
The low profile design of the ATS-20A-72-C2-R0 provides excellent heat dissipation while minimizing board space requirements. The unit features a precision extruded aluminum housing and a choice of different thermal interface materials to suit a variety of applications. Additionally, it offers the user flexibility in internal component placement and has flexible mounting options.
The ATS-20A-72-C2-R0 is designed for applications with air-flow as the primary means of heat dissipation, meaning that the heat sink must be positioned to allow for unrestricted air-flow. The ATS-20A-72-C2-R0 is tested to meet the industry standard EN 61766-1 for thermal shock resistance.
Working Principle
The ATS-20A-72-C2-R0 is a high-efficiency, low-profile heat sink that uses the principles of forced convection and thermal conduction to dissipate heat. The design of the heat sink utilizes an extruded aluminum housing with a large surface area, allowing air to flow over the heat sink and draw away the heat. This air flow is typically generated by external fans or other means of air movement.
The heat sink also uses the principle of thermal conduction. Heat generated by the electronic component is conducted through the heat sink, which dissipates the heat from the component to its surface and then through the extruded aluminum housing. Airflow over the heat sink then removes this heat from the device.
The combination of forced convection and thermal conduction allows the ATS-20A-72-C2-R0 to provide excellent heat dissipation. This makes it suitable for a wide range of applications which require efficient thermal management solutions.
Conclusion
The ATS-20A-72-C2-R0 is a low profile, aluminum extruded heat sink designed for cooling high-density electronics. It is suitable for a number of applications including personal electronics, medical devices, consumer electronics, automotive electronics, power supplies and other thermal management solutions. The ATS-20A-72-C2-R0 utilizes the combined principles of forced convection and thermal conduction to provide efficient heat dissipation, making it an ideal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference