ATS-20B-07-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20B-07-C1-R0-ND

Manufacturer Part#:

ATS-20B-07-C1-R0

Price: $ 3.31
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-07-C1-R0 datasheetATS-20B-07-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.00762
30 +: $ 2.92635
50 +: $ 2.76381
100 +: $ 2.60127
250 +: $ 2.43868
500 +: $ 2.35738
1000 +: $ 2.11351
Stock 1000Can Ship Immediately
$ 3.31
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are mechanical structures that are composed of metal and other thermally conductive materials, such as aluminum, copper, steel or plastic. Heat sinks are designed to dissipate heat away from a particular object, like an electronics component or a motors. Heat sinks are used to cool down the temperature of the object or component to prolong it’s lifetime and ensure its reliability.

The ATS-20B-07-C1-R0 is a high performance, versatile and expandable heat sink product with optimal performance and low profile design. It is designed for a wide variety of applications in industrial, commercial and military fields such as desktop PCs, servers, automotive, aerospace, and telecommunications.

The ATS-20B-07-C1-R0 heat sink is constructed from aluminum and uses thermal conductive elastomer pads and adhesive for mounting. This heat sink is designed with a thermal resistance of 0.07 °C/W and a Thermal conductivity of 1.2 W/m-K. It also has a maximum allowable temperature of 100 °C and a working temperature range of -55 °C to 95°C.

The ATS-20B-07-C1-R0 thermal solution contains an innovative fin element and a flat plate encapsulated in high quality extruded aluminum housing. This design allows for efficient heat dissipation to three dimensions: in the plane, in the axis and out of the plane, which results in greater heat dissipation efficiency and greater versatility in installation.

The ATS-20B-07-C1-R0 thermal solution is designed with two part construction: the fins and the plate. The fins are specificly designed to maximize heat flow from the device to the fins, while the plate acts as a conductor between the device and the heat sink. The fins are designed in such a way that they are able to dissipate heat from all directions, allowing for more uniform cooling.

The fins are also designed to provide flexibility in placement and installation. The fins are constructed in such a way that they are able to be bent in various positions in order to increase the surface area exposed to the ambient environment. This allows for greater airflow and cooling.

The ATS-20B-07-C1-R0 Thermal Solution is also designed with an optimized air channel design. This design improves the convective heat transfer and increases the surface area exposed to the air, allowing for better cooling of the device.

In addition, the ATS-20B-07-C1-R0 Thermal Solution is designed with an innovative attachment method that offers secure and fast installation. This is done by using adhesive and elastomer materials to ensure fast and secure installation. It can also be used with mechanical attachments, such as screws, rivets, and clips. This is done for ease of installation and greater reliability.

Overall, the ATS-20B-07-C1-R0 Thermal Solution is designed to provide optimal performance and versatility for a wide variety of applications in industrial, commercial, and military fields. It is constructed of aluminum and uses thermal conductive elastomer pads and adhesive for mounting. This heat sink is designed with a thermal resistance of 0.07 °C/W and a Thermal conductivity of 1.2 W/m-K, allowing for greater heat dissipation efficiency and versatility in installation. The ATS-20B-07-C1-R0 Thermal Solution also features an innovative fin element design, optimized air channel design, and an innovative attachment method for secure and fast installation.

The specific data is subject to PDF, and the above content is for reference

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