ATS-20B-116-C3-R0

Thermal - Heat Sinks

A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or mechanical device to a fluid medium, often air or a liquid coolant. Heat sinks are used to cool down many electronic components, as well as other mechanical devices that require cooling. The ATS-20B-116-C3-R0 heat sink is designed for high current applications, such as signal processing and power conversion devices.

Application of ATS-20B-116-C3-R0 Heat Sink

The ATS-20B-116-C3-R0 heat sink is designed for use in a variety of applications, including consumer electronics, industrial equipment, military and aerospace, and telecommunications systems. Some of the most common applications include:

• Computer and Server Cooling
• Power Supply Heat Management
• Telecommunications Equipment Cooling
• Battery Heat Management
• LED Strip Lighting Heat Management
• Heat Transfer Applications
• AC/DC Power Supplies

Working Principle of ATS-20B-116-C3-R0 Heat Sink

The ATS-20B-116-C3-R0 heat sink uses a combination of an integrally formed finned aluminum base and up to 8 copper elements to achieve cooling efficiency. The radiating surface area of the heat sink is increased by adding fins to the base, which allows the heat to spread out over a larger area and dissipate more quickly. Heat sinks typically rely on natural air convection, or forced convection, to transfer the heat away from the component and into the surrounding air.

In order to be most effective, heat sinks must also be installed in an area with good air flow. The more air that passes over the fins, the more effective the heat sink will be at dissipating heat. It is important to position the heat sink so that the rotating fan draws air across the fins in the right direction. A heatsink should also be mounted securely so that it keeps contact with the air passing across it, which increases its cooling efficiency.

One of the most important aspects of a heat sink is its thermal resistance. The thermal resistance is the amount of heat energy, or thermal energy, required to raise the temperature of the heat sink by one degree Celsius. Low thermal resistance allows more heat to be transferred from the component being cooled to the heat sink, leading to an increased cooling performance. The ATS-20B-116-C3-R0 heat sink has an exceptionally low thermal resistance of 0.67 C-in2/W, which makes it ideal for cooling high current devices.

Conclusion

The ATS-20B-116-C3-R0 heat sink is an efficient, high performance heat sink designed for use in high current applications. Its high radiating surface area and low thermal resistance allow it to efficiently dissipate heat from the component it is cooling, helping to ensure that the device operates within its normal temperature range. Proper installation and adequate air flow are key to maximizing its cooling performance.