| Allicdata Part #: | ATS-20B-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-20B-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20B-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20B-117-C1-R0 Thermal - Heat Sink is an efficient and reliable thermal management product. It provides extended heat dissipation and rapid cooling of electronic components and systems. The ATS-20B-117-C1-R0 Thermal - Heat Sink features a robust, low-profile solution with integrated side plates that can withstand operating temperatures up to +200°C. This makes it an ideal choice for enclosures and other high-power devices.
The ATS-20B-117-C1-R0 Thermal - Heat Sink can be used in a variety of applications, including power supply systems, LED lighting modules, circuit boards, aerospace and defense subsystems, and medical electronics. Its integrated design helps to reduce device temperatures, increase reliability, and improve product lifetime overall. It also helps to reduce the need for additional cooling fans and other components within the system.
The ATS-20B-117-C1-R0 Thermal - Heat Sink uses metalized films to improve heat dissipation. The metalized films are set in an anodized aluminum frame and attached to the aluminum fins, which help to increase the surface area available for heat dissipation. The metalized films also create a thermal barrier between the electronics and the aluminum fins, helping to keep the device temperatures lower. The fins are also positioned on an angle to allow for greater airflow and increased heat removal.
The ATS-20B-117-C1-R0 Thermal - Heat Sink also comes with integrated mounting brackets, making attachment to the device’s circuit board easy. The heat sink can also be used with a wide variety of thermal management solutions, including thermal tape, thermal interface material, or other thermal greases.
The ATS-20B-117-C1-R0 Thermal - Heat Sink is designed for low power applications with up to 10W of thermal emissions. This advanced product is UL approved and meets industry standards. It is also RoHS compliant and encapsulated in CA-YES accesible material.
The ATS-20B-117-C1-R0 Thermal - Heat Sink is an effective solution for cooling and dissipating heat in a wide variety of applications. Its integrated design helps to reduce device temperatures, increase reliability, and improve product lifetime overall. With its robust design, extended heat dissipation and rapid cooling capabilities, the ATS-20B-117-C1-R0 Thermal - Heat Sink is an ideal choice for enclosure and other high-power devices.
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