ATS-20B-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20B-12-C1-R0-ND

Manufacturer Part#:

ATS-20B-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-12-C1-R0 datasheetATS-20B-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-20B-12-C1-R0 heat sink is a highly advanced device used to conduct heat away from sensitive components. This type of heat sink is designed to fit a variety of applications and can be used with a variety of thermal solutions. It is designed for use with devices with low thermal resistance, such as CPUs, GPUs and other electronic devices which require high levels of thermal energy management. It is also suitable for applications which require extremely high conductivity, including cooling systems, LED lighting and automotive applications.

Application Field

The ATS-20B-12-C1-R0 heat sink is a versatile device, which can be used in a variety of applications. It is ideal for use in cases where high thermal resistance is necessary, such as servers, computers, gaming consoles, and other electronics that require high levels of thermal energy management. This device is also suitable for use in applications which require extremely high conductivity, such as cooling systems, LED lighting, and automotive applications. The device is capable of dissipating up to 150 Watts of power, making it an ideal choice for high-powered systems and applications.

Working Principle

The ATS-20B-12-C1-R0 heat sink works by dissipating heat away from hot components by passing it through fins. These fins are typically made of aluminum and have an exceptionally high thermal resistance. The fins are arranged in such a way that they provide a low impedance path for the heat to escape. The aluminum fins are designed in such a way that they are able to transfer the heat to the surrounding air in a very efficient manner. The device also includes a fan to help dissipate the heat even further.

The ATS-20B-12-C1-R0 heat sink also utilizes thermal gap fillers, which help to further dissipate the heat. Thermal gap fillers are made of advanced materials which help to fill in the small gaps between the hot components and the fins, allowing the thermal energy to disperse evenly. In addition, the gap filler also helps to reduce any hot spots in the system, which can lead to overheating. The device also features a special thermal conductive coating which helps to further transfer the heat away from hot components and towards the fins.

In addition, the ATS-20B-12-C1-R0 heat sink also includes a special thermal paste, which helps to maximize the thermal conductivity and ensure that all the hot components are efficiently cooled. The paste helps to further dissipate the heat and spread it evenly across the heatsink. The paste also helps to reduce thermal resistance, which helps to keep the components running at optimal temperatures.

Conclusion

The ATS-20B-12-C1-R0 heat sink is an advanced device that is designed to efficiently dissipate heat away from sensitive components. It features advanced fin designs which provide an extremely low thermal resistance, and also includes a fan and thermal gap fillers to further dissipate the heat. The device also utilizes a special thermal paste which helps to maximize the thermal conductivity, ensuring that all the hot components are efficiently cooled. Overall, the ATS-20B-12-C1-R0 heat sink is an excellent choice for applications that require high levels of thermal energy management.

The specific data is subject to PDF, and the above content is for reference

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