ATS-20B-137-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.63°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

A thermal - heat sink is an important component found in many applications where efficient cooling of processors or other components must be achieved. The ATS-20B-137-C3-R0, is a suitable device for such applications. This device features a number of advantages over other cooling options. Its aluminum construction is both lightweight and corrosion resistant. The device has a good thermal conductivity rating. It is also affordable and available in a wide range of sizes. The device operates via convection cooling. This means that heat is transferred away from the device via a thermal circulating fluid. In this case, the fluid is air. The air around the device heats up as it absorbs heat from the device. As the air temperature rises, the device radiates heat away from it. This process is repeated until the device reaches its desired temperature.The ATS-20B-137-C3-R0 has a square, finned design and is made from extruded aluminum. This design helps to maximize air flow in order to maximize cooling. It is capable of dissipating a maximum of 20W of power and has a maximum temperature of 137°C. The device can be used in a wide range of applications, such as computers, electronics, and industrial equipment. As mentioned earlier, it is capable of dissipating a maximum of 20W of power, making it suitable for cooling even the hottest of processors. It is also ideal for applications that require a small, lightweight cooling solution. Its ease of installation makes it suitable for both new and existing installations. The device is designed to mount directly onto the surface of the processor or other component, thus saving space. It also features a powder-coated finish that helps to protect against dust and debris from entering the system. In conclusion, the ATS-20B-137-C3-R0 is a great device for efficiently cooling processors or other components. Its aluminum construction is both lightweight and corrosion resistant. The device has a good thermal conductivity rating and is capable of dissipating a maximum of 20W of power. It has a simple, easy to install design and features a powder-coated finish. Overall, it is an ideal device for thermal - heat sink applications.

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