| Allicdata Part #: | ATS32991-ND |
| Manufacturer Part#: |
ATS-20B-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20B-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics has become increasingly important as electronics become smaller and dissipate more power. Heat sinks are used to absorb, transport, and dissipate the heat from the components. ATS-20B-142-C2-R0 is a heat sink that is specifically designed to provide thermal management for processor-based systems.
Description of ATS-20B-142-C2-R0
The ATS-20B-142-C2-R0 is a two heat sink design and is designed for optimal heat transfer and dissipation with a finned base composed of an extruded aluminum alloy in a single-piece design. The finned base ensures outstanding air flow with high thermal conductivity. The base product is supplied with a black anodized finish but may be custom coated to meet specific customer application requirements. The ATS-20B-142-C2-R0 is also available with a variety of mounting options such as clip-on hardware, stand-offs, or stud mounting.
Application Field and Working Principle
The ATS-20B-142-C2-R0 is designed for cooling commercial grade processors, microprocessor boards, and digital devices in systems such as printers, copiers, control boards, and other commercial electronics. The heat sink design ensures maximum contact with the processor and effectively dissipates heat away from the processor to keep it running at optimal temperatures.
The working principle of the ATS-20B-142-C2-R0 heat sink is based on the thermodynamic principles of conduction and convection. Heat absorbs from the processor in the form of radiation, which is then conducted and convected through the heat sink. The fin shape of the heat sink increases the surface area, allowing more heat to be dissipated. The heat dissipation is amplified by the addition of a fan to help cool the heat sink as well as blowing cool air over the processor itself.
Considerations for Thermal Management
When selecting the right thermal management solution for a systems, several factors need to be considered. The most important factor is the amount of heat generated by the processor itself. The size and shape of the processor in relation to the space available needs to be considered. The allowable temperature range of the processor has to be taken into account. Other factors such as fan noise, fan speed, and airflow must also be considered.
In addition to these considerations, it is important to select the right heat sink design that is able to efficiently disperse the heat. The ATS-20B-142-C2-R0 heat sink is an efficient solution that is highly effective at dissipating heat and keeping processors running at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference