ATS-20B-145-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20B-145-C1-R0-ND

Manufacturer Part#:

ATS-20B-145-C1-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-145-C1-R0 datasheetATS-20B-145-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.68°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-20B-145-C1-R0 thermal heat sink application field and working principle

ATS-20B-145-C1-R0 thermal heat sinks are commonly used to dissipate heat generated by electronic devices. It is designed to quickly absorb and disperse heat away from a device. This type of heat sink is one of the most common and widely used in applications ranging from consumer electronics to industrial and medical applications.

The most common application of this type of heat sink is to dissipate the heat generated by CPU and power transistors in electronic devices. It also plays an important role to absorb and dissipate heat from high-power semiconductor devices, such as lasers, amplifiers and power supplies. In addition, it can also be used in moving parts and power tools to reduce wear from heat friction.

The working principle of ATS-20B-145-C1-R0 thermal heat sinks is based on the process of convection. It uses the air around it as a medium of conduction to transfer heat away from the device. The heat is dissipated from the surface of the heat sink\'s fins and then dissipated into the surrounding air. This is made possible by the air passing over the fins of the heat sink.

The ATS-20B-145-C1-R0 thermal heat sink is designed with specific parameters to ensure that it can effectively and efficiently dissipate heat away from the device. These parameters include the surface area of the heat sink, the area-to-volume ratio, and the number of fins on the heat sink. The surface area of the heat sink is important to ensure that it can dissipate heat quickly. The area-to-volume ratio is important to ensure that the heat sink can exchange heat quickly and efficiently. The number of fins on the heat sink will also affect the heat dissipation rate. The more fins, the better the heat dissipation.

The ATS-20B-145-C1-R0 thermal heat sink is also designed with exposed fins for maximum air flow and heat dissipation. This type of heat sink also has a fin design that increases airflow by up to 30 percent, which helps to maintain optimal thermal performance. In addition, this type of heat sink is designed with a variety of materials to ensure that it can also heat and dissipate extreme temperatures.

In addition, this type of heat sink also comes with fan options to help dissipate the heat further away from the device. This type of fan is designed to move the air further away from the device, which is important for longer-term performance. This type of fan is also designed to reduce noise and it is often used as part of a cooling system in industrial or medical applications.

The ATS-20B-145-C1-R0 thermal heat sink is an ideal choice for a variety of electronic devices due to its efficient heat dissipation. Its design and materials make it suitable for a variety of applications, and its fan option also helps to reduce noise and provides better cooling performance. This type of heat sink is also designed to withstand high temperatures and is therefore ideal for use in high-power devices. It is also widely used in consumer electronics due to its reliability and cost efficiency.

The specific data is subject to PDF, and the above content is for reference

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