ATS-20B-157-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.35°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-20B-157-C2-R0 Application Field and Working Principle

Heat Sinks are an essential component in the electronic system and lead to improved performance and extended life of the devices. The ATS-20B-157-C2-R0 is a heat sink developed by Alco from Taiwan that is designed specifically for use in the semiconductor and electronics industries. It is designed to work with components such as MCUs, SoCs, chipsets, and FPGAs, and is designed to dissipate heat that arises out of the operation of these components.

Applications of the ATS-20B-157-C2-R0 Heat Sink

The ATS-20B-157-C2-R0 heat sink can be used in a variety of different applications. It is often used in industrial applications such as energy management systems, factory automation, and robotics. It can also be used in consumer electronics such as gaming computers, set-top-boxes, and smart-home devices. Additionally, it is often used in medical devices such as pacemakers, insulin pumps, and medical imaging devices.

Features of the ATS-20B-157-C2-R0 Heat Sink

The ATS-20B-157-C2-R0 heat sink has several features that make it a desired choice for use in a variety of applications. It is made out of a thermally conductive aluminum material that is able to efficiently dissipate heat from the components it is attached to. It is designed with a slotted profile and an upper section that is purposely made to be slightly larger in order to help increase the surface contact area between the heat sink and the component. It is also designed with ribbed fins that run along the perimeter of the heat sink. These ribbed fins effectively increase the surface contact area between the heat sink and the component as well as increase the rate of dissipation of heat.

Installing the ATS-20B-157-C2-R0 Heat Sink

The installation of the ATS-20B-157-C2-R0 heat sink is fairly straightforward. It comes with all the necessary mounting hardware needed to secure it to the component. Before installation, it is highly recommended that the heat sink is tested on the component to ensure proper and efficient functioning. Once the heat sink is secured to the component, it is then recommended that thermal paste, thermal tape, or a similar product is applied to the contact area between the heat sink and the component in order to provide an enhanced level of heat transfer.

Working Principle of the ATS-20B-157-C2-R0 Heat Sink

Heat sinks work by dissipating heat away from the components they are attached to and dispersing it into the surrounding environment. This is made possible through the thermal conductive properties of the aluminum material that the ATS-20B-157-C2-R0 heat sink is made of. As the heat sinks absorb the heat from the components, it is then transferred away from the device and dissipated into the surrounding environment through the use of the ribbed fins and the slotted profile design.

Conclusion

Heat sinks play an important role in the safe and efficient operation of electronics. The ATS-20B-157-C2-R0 is a heat sink that has been specifically designed for use with various components such as chipsets, MCUs, SoCs, and FPGAs. It is designed with a robust aluminum material that is able to effectively and efficiently dissipate heat from these components. It also comes with ribbed fins that provide better surface contact area for heat transfer as well as a slotted profile design that helps with heat dispersal. When installed properly, the ATS-20B-157-C2-R0 heat sink can provide a safe and efficient way to dissipate heat away from components.

The specific data is subject to PDF, and the above content is for reference