ATS-20B-170-C3-R0

The ATS-20B-170-C3-R0 is a thermal-heat sink designed and developed for industrial cooling applications. It is used for efficient dissipating of heat from electronic components such as LEDs, microcontrollers, processors, and power ICs. With its large heat sink size of 180mm x 200mm and its standard depth of 37mm, it is able to effectively cool large devices. The ATS-20B-170-C3-R0 is constructed with a combination of aluminum fins and vapor chambers that enable efficient cooling.

An aluminum frame is also added to ensure structural stability. This frame aids in further helping to dissipate the heat away from the components. The aluminum fins also act as heat pipes, allowing heat to flow directly from the components to the fins where it can be efficiently dissipated. The purpose of the vapor chamber is to further reduce the temperature of the already-cooled heat sink by efficiently transporting heat away from the hot areas. This ensures the ATS-20B-170-C3-R0 is able to effectively cool even the hottest components.

This thermal-heat sink also comes with pre-installed surface treatments for better performance. These treatments include thermal conduction silicone, heat sink compound, and thermal tape, all of which help to reduce the thermal resistance between the components and the heat sink. This helps to ensure maximum thermal transfer from the components to the heat sink. The mounting screws are also provided for easy installation to accommodate various devices.

Overall, the ATS-20B-170-C3-R0 thermal-heat sink is a great choice for efficient cooling of industrial components. With its large size, pre-installed treatments, and mounting screws, it ensures optimized cooling performance in a range of applications. It also eliminates the need for additional fan or cooling systems, saving time and money. The ATS-20B-170-C3-R0 is a great durable and reliable heat sink solution for industrial cooling requirements.