ATS-20B-173-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.68°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are a vital component of many electronic systems, particularly those using either high-speed signal processing or high-power electronics. Ensuring the optimal functioning of the equipment, the heat sink regulates and controls the heat generated by the system. ATS-20B-173-C1-R0 is a thermal - heat sink specifically designed to keep surface temperatures below their allowed threshold and manage heat dissipation.

Composition and Design

ATS-20B-173-C1-R0 is composed of a central copper base encased by an aluminum fin layer. The aluminum fin layer features 0.25mm fins held at 3mm center-line intervals. The encompassing fin angle is 48° with a thermal conductivity of 2.9W/mK. This makes the heat sink capable of dissipating up to 173W of heat at 0.3C/W using the natural convection process. Its metal composition generally allows for higher air-flow and gives it a higher durability than normal plastic composites. The copper base ensures a good thermal performance with a low allowable temperature, while the fin layer linearly extends that performance.

Application Field and Working Principle

The ATS-20B-173-C1-R0 is actively utilized in applications related to computers or electronic systems that require the dissipation of high amounts of heat, such as those seen in Voltage Regulator Modules (VRMs). By using the natural airflow process, the heat sink assists in cooling the system by releasing the heat outwards. This increases the efficiency of the system by ensuring a consistent allowable temperature for the CPU components. The unwieldy fin design and highly conductive metal also serve to increase surface area for a greater release of heat.

Conclusion

ATS-20B-173-C1-R0 is a thermal - heat sink specifically designed to manage and regulate surface temperatures more effectively. Through its unwieldy fin design, low thermal conductivity, and highly conductive metal base, it can dissipate up to 173W of heat with the assistance of the natural convection process. Its primarily targeted at computers or electronics requiring consistent allowable temperatures and serves to increase their efficiency by actively releasing heat.

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