ATS-20B-194-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS33048-ND

Manufacturer Part#:

ATS-20B-194-C2-R0

Price: $ 3.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-194-C2-R0 datasheetATS-20B-194-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.20040
10 +: $ 3.11472
25 +: $ 3.03055
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.07°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks - ATS-20B-194-C2-R0 Application Field and Working Principle

Thermal – Heat Sinks are essential for assisting in the process of cooling any electronic device and they are often found as a part of an electronic system. The ATS-20B-194-C2-R0 Heat Sink is made to fit with MIL-STD-194 and GS-T20B-TP standards, providing superior performance and reliability in a broad range of applications. This Heat Sink is designed to be resistant to extreme vibration and shock and is usually used in extreme environments.

The ATS-20B-194-C2-R0 Heat Sink is designed for thermal management. It is made from a copper alloy with a high level of thermal conductivity, increasing the efficiency of heat transfer and dissipation. This Heat Sink has a unique structure consisting of a base plate with integrated heat spreader fins. The fins are designed to dissipate heat generated by electronic devices quickly and reliably. This Heat Sink is also designed with two mounting holes and two adjustable mounting clips for easy installation.

The working principle of the ATS-20B-194-C2-R0 Heat Sink is simple. The copper alloy base plate of the Heat Sink is heated by the components of the device it is connected to. The thermal energy generated by the components is transferred to the base plate which then transfers it to the fins. The fins act as a large radiating surface for the thermal energy, dissipating the heat into the environment rather than keeping the device hot.

The ATS-20B-194-C2-R0 Heat Sink is designed for a wide variety of applications, including rugged industrial computers, data center servers, robotic systems, communication systems, test and measurement systems, and embedded systems. This Heat Sink is suitable for operation in temperatures ranging from -55°C to +125°C and is highly resistant to smoke and fire, making it suitable for use in hazardous environments. This Heat Sink has a wide range of benefits, including high thermal performance, durability, and low cost.

The ATS-20B-194-C2-R0 Heat Sink is an efficient heat management solution for a wide variety of applications. Its high level of thermal conductivity and unique structure make it ideal for dissipating heat from electronic components, reducing the operating temperature of the device and allowing it to operate more reliably in extreme temperatures. This Heat Sink is also designed to be resistant to shock, vibration, and smoke, making it suitable for use in a wide variety of applications.

The specific data is subject to PDF, and the above content is for reference

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