| Allicdata Part #: | ATS-20B-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-20B-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20B-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The Thermal - Heat Sinks ATS-20B-197-C1-R0 is a solution for cooling electronic components, providing better reliability and extending the lifetime of the product. It consists of two halves that are symmetry-mounted to the chip or PCB, with the outside half forming the heat wall and the interior half forming the contact heat sink. It is made of aluminum or copper and is designed to improve heat dissipation for applications that require higher power density and less space. It can also provide protection from corrosion and electrical shorts due to its tight, close-fitting design.
Application Field
The ATS-20B-197-C1-R0 is designed for use in commercial and industrial electronics products and its applications include computers, telecom systems, telecommunication networks, data acquisition systems, measurement and control systems, motor control systems, industrial communications devices, military/aerospace equipment, and various other electronic products. It\'s specifically designed for applications that need a reliable solution for cooling and improved heat dissipation.
Working Principle
A combination of the air convection and conduction principles are used in this design. With the help of an air convection force generated from the outside of the product itself, the heat wall works to exchanges air surrounding the product, acting as an insulator to reduce the temperature inside the product. At the same time, the internal contact heat sink generated by the outside half creates thermal contact between the chip or PCB with the heat sink which in turn helps dissipate the heat into the air around the product, helping to cool down the interior components.
In addition, the ATS-20B-197-C1-R0 also uses a thermally conductive fillings and materials, such as ceramic, plastic, or a specific type of grease, to get closer contact between the internal and external parts. This helps increase the overall heat dissipation performance of the product.
The ATS-20B-197-C1-R0 is also designed to be resistant to corrosion which makes it suitable for applications in harsh, humid environments. It also can provide improved protection from electrical shorts due to the tight, close-fitting design. It also offers flexibility in installation due to its adjustable mounting brackets, making it easier to install in different places of a system.
Benefits
The ATS-20B-197-C1-R0 offers a variety of benefits which include improved heat dissipation, protection from electrical shorts, better reliability and a longer lifetime. With the help of a combination of air convection and conduction principles, the heat wall and contact heat sink help to cool down internal components and protect them from heat damage. The tight, close-fitting design helps to reduce the risk of electrical shorts, as well as offering protection from corrosion which makes it ideal for applications in damp, humid climates. Furthermore, the adjustable mounting brackets facilitate easier installation while the thermally conductive fillings and materials improve the overall heat dissipation performance and reliability of the product.
The specific data is subject to PDF, and the above content is for reference