ATS-20B-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20B-20-C3-R0-ND

Manufacturer Part#:

ATS-20B-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-20-C3-R0 datasheetATS-20B-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical for electrical and mechanical components that produce heat due to electrical or mechanical stresses. Heat sinks are an important part of thermal management systems as they provide a mechanism for dissipating heat generated by other components, allowing them to operate efficiently without overheating. The ATS-20B-20-C3-R0 heat sink is one such product designed to provide effective heat dissipation for a variety of applications.

The ATS-20B-20-C3-R0 is designed to meet many needs in the field of thermal-heat sinking. This heat sink is constructed with a rugged aluminum frame and fins, which creates an effective heat transfer surface. It also utilizes an octagonal cross-flow design, which helps increase air flow velocity and creates an effective heat dissipation rate. The heat sink utilizes a large-area heat dissipation with the use of surface mount screws or slots, which can be easily attached on to any heat source. In addition, the design helps reduce noise levels due to the high-speed flow of air velocity that it utilizes.

The ATS-20B-20-C3-R0 heat sink is perfect for applications where effective thermal performance is required. This product is ideal for such applications such as voltage regulators, power supplies, LED lighting, and telecom equipment. It is also perfect for environments with high humidity levels, where moisture may cause problems with proper heat dissipation. This product is also great for high efficiency applications, as it can reduce temperature rise significantly.

The working principle of the ATS-20B-20-C3-R0 is based on the principle of convection. The heat sink is designed to allow for the most efficient airflow as possible. The air is drawn over the fins of the heat sink, allowing the air to absorb heat generated from the heat source, and then dissipates it through the fins and eventually out into the environment. This constant flow of increased air velocity helps maintain a constant temperature, preventing overheating.

The ATS-20B-20-C3-R0 heat sink is specifically designed to provide maximum performance while providing maximum reliability and durability. With its higher rate of heat transfer and larger surface area, this product can provide a reliable and efficient solution for many thermal related applications. It is also RoHS Compliant and can be used in a variety of operating environments, from industrial to consumer applications.

The ATS-20B-20-C3-R0 heat sink provides an effective solution for applications where efficient heat dissipation is required. With its octagonal cross-flow design, it promises improved airflow and is designed to reduce noise levels. It is also RoHS Compliant, rugged, and can be easily mounted on to any heat source. The heat sink is an ideal choice for applications in the telecommunications, LED lighting, and power supplies industries, as well as many other areas that require reliable and efficient thermal performance.

The specific data is subject to PDF, and the above content is for reference

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