ATS-20B-207-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20B-207-C3-R0-ND

Manufacturer Part#:

ATS-20B-207-C3-R0

Price: $ 4.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X12MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-207-C3-R0 datasheetATS-20B-207-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.21029
30 +: $ 3.97635
50 +: $ 3.74245
100 +: $ 3.50860
250 +: $ 3.27469
500 +: $ 3.04079
1000 +: $ 2.98231
Stock 1000Can Ship Immediately
$ 4.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.47°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-20B-207-C3-R0 application field and working principle

ATS-20B-207-C3-R0 is a thermal heat sink with a variety of applications. This device is primarily designed to dissipate heat from electrical and electronic components and other systems. Heat sinks are widely used in various industries including electronics, medical, industrial, and automotive. It plays an essential role in dissipating heat to ensure reliability and performance of the system.

Overview

The ATS-20B-207-C3-R0 is a unique thermal heat sink that is designed for cooling electronic components and various systems. The device features a combination of materials such as aluminum and copper in its construction. This heat sink may be constructed with either the aluminum or copper materials, depending on the application requirements. The device has two versions, a regular version and a low-profile version. Both versions come in a standard size of 20.3mm x 13.2mm x 7.3mm (LxWxH).

Features

The ATS-20B-207-C3-R0 offers several features that make it ideal for a variety of applications:

  • High thermal conductivity – The device has a high thermal conductivity that allows it to effectively dissipate heat away from components and systems.
  • Highly durable – The device is highly durable and can withstand temperatures up to 500°C. This makes it suitable for a wide range of applications.
  • Lightweight – The device is lightweight and therefore easy to install and maintain.
  • Low maintenance – The device requires minimal maintenance and can last for years.

Working Principle

The ATS-20B-207-C3-R0 works on the principle of thermodynamics. Heat is generated due to electrical or electronic components, and the heat has to be dissipated in order to maintain the ambient temperature. The device works by conduction. Heat generated by the components is transferred to the heat sink through conduction. Heat is then dissipated from the heat sink surface into the atmosphere in the form of thermal energy.

The heat sink is designed to facilitate the efficient dissipation of heat. The device has a large surface area to maximize the heat transfer from the components to the atmosphere. The device is also designed with fins which aid in the dispersal of heat into the atmosphere. The device is also designed strategically so that the heat is dispersed evenly

Applications

The ATS-20B-207-C3-R0 is primarily used in electronics, medical, industrial, and automotive applications. It is suitable for a wide range of components including CPUs, GPUs, voltage regulators, transistors, and other components. It is also suitable for cooling systems such as medical imaging equipment, server racks, and 3D printers.

The device is also used in telecommunications systems, automotive systems, and military applications. The device is highly reliable and can withstand temperatures up to 500°C, which makes it ideal for harsh environments. The device is also lightweight and easy to install, making it suitable for various applications.

Conclusion

The ATS-20B-207-C3-R0 is a high-quality thermal heat sink with a variety of applications. It is highly durable, lightweight, and easy to install. The device is suitable for a wide range of components and systems, and can withstand temperatures up to 500°C. The device works on the principle of thermodynamics and dissipates heat through conduction and finned surfaces. The device is widely used in electronics, medical, industrial, and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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