ATS-20B-50-C1-R0

ATS-20B-50-C1-R0 is a thermal – heat sink with an effective size measuring 50mm x 50mm x 25mm. It is designed to dissipate heat away from components and sensitive circuits by using multiple thermal conduction resources. It is an advanced heatsink product developed by Hi-Q Technology Company.

The ATS-20B-50-C1-R0 heat sink is ideal for a variety of electronic components, such as conductive plate modules, audio amplifiers, power supplies, and driver modules. Additionally, it can be applied to equipment and instrumentation operations, like intelligent instrumentation, telecommunications hardware, and office equipment.

The ATS-20B-50-C1-R0 heat sink works by providing thermal conduction paths through four channels in the frame. Each channel is connected to a heat plate of different size and thickness. This allows for heat distribution to be directed into multiple directions for optimal dissipating effect. Additionally, the heat sink offers four thermal conduction boards, which are connected to copper base pipes, to further enhance heat distribution rate.

The ATS-20B-50-C1-R0 heat sink has excellent performance, particularly when coupled with thermal grease. The thermal grease helps to improve thermal conductivity and allows for maximum heat transfer from the component to the heat sink. Additionally, the copper base pipes can easily dissipate heat from the component side of the heat sink into the air. It ensures the component is kept at an optimal temperature, while providing maximum heat dissipating efficiency.

In addition to offering excellent performance, the ATS-20B-50-C1-R0 heat sink also offers significant advantages to the user. Firstly, the device has a lightweight and slim design that ensures a secure fit for numerous components. Secondly, it is also resistant to vibration and corrosion, enabling it to last longer than other types of heat sinks. Finally, the special design allows for greater air circulation and heat dissipation, affording improved heat dissipation performance.

The ATS-20B-50-C1-R0 heat sink is an impressive thermal - heat sink product developed by Hi-Q Technology Company. It has an effective size of 50mm x 50mm x 25mm and provides excellent thermal conduction paths through four channels in the frame. Furthermore, it can be applied to a variety of electronic components and equipment and instrumentation operations, enabling improved heat dissipation. Finally, the device is highly resistant to vibration and corrosion and has a lightweight and slim design for a secure fit.