| Allicdata Part #: | ATS-20B-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-20B-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20B-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of modern electronics, as temperature can greatly influence the performance and longevity of a device. Heat sinks are one of the components used to reduce and dissipate heat in electronic systems, and ATS-20B-55-C1-R0 is a popular type of heat sink for many applications. This article will provide an overview of the ATS-20B-55-C1-R0’s application fields and working principle.
In general, the ATS-20B-55-C1-R0 is a high performance, low profile heat sink that is suitable for a wide range of applications. It is designed to provide optimal cooling performance and reliability, and is suitable for use in a variety of industries. Some of the most common application fields for the ATS-20B-55-C1-R0 include telecommunications, medical devices, instrumentation, industrial automation, and automotive electronics.
The ATS-20B-55-C1-R0 is rated for a maximum ambient temperature of 70 degrees Celsius, and features a built-in thermal protector to protect against overheating and damage. The overall dimensions of the heat sink are 50mm x 65mm x 34mm, and it is capable of dissipating a maximum of 16 W of heat. It has a low profile design and is designed to be robust, reliable, and highly efficient.
The ATS-20B-55-C1-R0 is designed to operate on a thermal management principle known as convection, which involves the use of air flow to move heat away from the device. This air flow is generated by the heat sink’s fins, which are designed to maximize heat transfer to the ambient air. The heat sink also utilizes a high-performance metallic thermal compound to increase thermal conduction between the fins and the device.
In addition to convection, the ATS-20B-55-C1-R0 also has a self-regulating feature that allows it to autopilot its own temperature. The self-regulation is achieved by monitoring the temperature of both the sink and the device, and adjusting the fan speed to keep the device running at its optimal temperature.
The ATS-20B-55-C1-R0 is a popular choice for many applications, due its compact size, efficient performance, and self-regulating features. It is designed to provide a cost-effective solution for heat dissipation in a variety of applications, and is suitable for use in a wide range of settings. The ATS-20B-55-C1-R0 is an excellent choice for those looking for a reliable, efficient, and cost-effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference