| Allicdata Part #: | ATS-20B-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-20B-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20B-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal devices used to dissipate heat generated from electronic systems. The ATS-20B-60-C3-R0 is a high-performance thermal device used for efficiently managing heat in …
The ATS-20B-60-C3-R0 is a high-performance heat sink designed to optimize thermal management in multiple applications. This type of heat sink is commonly used in the industrial, automotive, and telecommunications industries. It is also widely used in electronic appliances and embedded systems. This heat sink is an aluminum-based structure and features a honeycomb design and an optimized fin geometry for an optimum cooling performance.
The ATS-20B-60-C3-R0 was designed with a particular application field in mind. It is designed to dissipate heat generated from high-power devices operating at high temperatures. This includes motor drivers, power filters, power amplifiers, and other high-power peripheral devices. The heat sink can also be used in other applications where heat needs to be managed efficiently.
The ATS-20B-60-C3-R0 is designed using a special set of principles and technologies. The heat sink is designed to have a high-efficiency thermal design to dissipate heat efficiently and keep components from overheating. The construction of the heat sink also ensures that the heat is evenly spread throughout the surface. The heat sink also features an optimized fin geometry for increased cooling performance.
The ATS-20B-60-C3-R0 is highly efficient at dissipating heat compared to other thermal devices. The special construction of the heat sink ensures that heat is evenly spread across the entire surface of the device. This allows for a more efficient cooling performance and less heat build up. The heat sink also features an optimized fin geometry that increases the cooling performance and allows for more efficient heat dissipation.
The ATS-20B-60-C3-R0 is an ideal thermal solution for applications that require efficient heat dissipation. It offers a highly efficient design that ensures optimal heat management. The Honeycomb design and optimized fin geometry ensure a high-performance cooling solution. The optimized construction of the heat sink ensures that the heat generated from the device is dissipated quickly and efficiently. The ATS-20B-60-C3-R0 is highly effective at dissipating heat and is an ideal solution for applications that require efficient heat management.
The specific data is subject to PDF, and the above content is for reference