ATS-20B-72-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20B-72-C3-R0-ND

Manufacturer Part#:

ATS-20B-72-C3-R0

Price: $ 5.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20B-72-C3-R0 datasheetATS-20B-72-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.63806
30 +: $ 4.38060
50 +: $ 4.12297
100 +: $ 3.86524
250 +: $ 3.60755
500 +: $ 3.34987
1000 +: $ 3.28546
Stock 1000Can Ship Immediately
$ 5.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.19°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components of any electronic system, as they help to dissipate heat generated during operation. These heat sinks come in many different forms depending on the application, and ATS-20B-72-C3-R0 is a good example of a heat sink used in many industrial electronic applications.

The ATS-20B-72-C3-R0 is a finned heat sink, meaning it has a series of channels and ridges to increase its surface area. This increased surface area helps to create greater convection, which is the transfer of heat from the hot surface area to the cooler ambient environment. The fins of the heat sink are made from lightweight aluminum alloy, and are designed to dissipate up to 150 watts of power, making it suitable for many modern electronic applications like power converters, regulators and power amplifiers.

The 84-pin ATS-20B-72-C3-R0 has dual-sided fins on a single-piece design, which helps reduce thermal resistance. This allows the heat generated by the electronic components to quickly be transferred away from the chip, thus keeping it in a safe operating range. The heat sink consists of multiple heat pipes spanning the length of the fins, allowing air to pass between them and absorb heat more effectively than traditional cooling solutions. The integrated fan, or fan shrouds, helps to move this heat away from the heat sink more quickly, thus helping to prevent it from becoming excessively hot.

The design of the ATS-20B-72-C3-R0 ensures an efficient cooling system that is reliable and durable. The heat sink uses a low-flux material, which is highly reflective and helps to reduce the amount of heat absorbed from the source. Additionally, the heat sink has an integrated ‘L’ shaped mounting bracket that helps to ease installation and can be removed without compromise. This makes the heat sink suitable for both aesthetic and functional applications.

The ATS-20B-72-C3-R0 is ideal for many different industrial applications and is capable of dissipating up to 150 watts of power. This makes it suitable for a wide range of electronic components, which it helps to cool by dissipating the heat away from them quickly and effectively. The ATS-20B-72-C3-R0 is designed to be extremely durable, and its integrated low-flux heating material and multi-fan cooling system help to ensure that it remains efficient throughout its lifespan.

The specific data is subject to PDF, and the above content is for reference

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