| Allicdata Part #: | ATS-20B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-20B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is an essential thermal management device for many applications, including computers, consumer electronics, and medical equipment. With the use of a heat sink, excess heat can be redirected from hot components or equipment, allowing for improved performance and reliability.
The ATS-20B-76-C3-R0 is a smart heat sink designed for a variety of applications. It is constructed with a lightweight aluminum frame and high-grade thermal interface material. This provides maximum heat dissipation while utilizing minimal space. The thermal performance of this heat sink is further enhanced by its low profile design and low parasitic air gap.
The thermal interface material in the ATS-20B-76-C3-R0 helps to accelerate heat dissipation by providing a direct contact between the device and the heat sink. This aids in the development of a more efficient thermal connection. The low profile design also serves to reduce the perpendicular force upon the components, preventing potential damage from excessive heat. The low gap between the device and heat sink also allows for improved airflow, ensuring greater efficiency of the thermal systems.
The ATS-20B-76-C3-R0 thermal management system can be used for a variety of applications. One such application is the cooling of CPUs in computer systems. The heat sink can be optimized for cooling performance by attaching a fan or other appropriate device. This allows CPUs to perform at peak performance, providing a key advantage in both commercial and gaming applications. Additionally, the ATS-20B-76-C3-R0 is an effective solution for applications such as laser diodes, LED arrays, and other LCD displays, due to its ability to support a wide range of operating temperatures.
In conclusion, the ATS-20B-76-C3-R0 heat sink is an ideal cooling solution for many applications. Its light-weight design and optimized thermal interface material provide excellent heat dissipation and ensure maximum performance and reliability. Additionally, its low profile makes it an ideal choice for heat-sensitive components, while allowing for improved airflow and thermal efficiency. As such, the ATS-20B-76-C3-R0 heat sink is an excellent choice for any thermal management system.
The specific data is subject to PDF, and the above content is for reference