| Allicdata Part #: | ATS33142-ND |
| Manufacturer Part#: |
ATS-20C-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are often used in a wide array of applications due to their ability to efficiently dissipate heat. This article will discuss the application field and working principle of the ATS-20C-10-C2-R0 thermal heat sink.
A thermal heat sink is designed to transfer heat from one point to another. In the case of the ATS-20C, the heat source is the device of interest and the heat sink is the ATS-20C itself. The heat is conducted from the source through an aluminum base plate that features integrated fins that are constructed from extruded aluminum. The fins act as a thermal conduit and dissipate the heat away from the source more quickly and efficiently.
The ATS-20C offers a wide range of applications. It can be used to cool down both air and liquid-cooled components in systems, such as CPUs, GPUs, memory modules, power transistors, FPGAs, and other high-powered components. It can also be used in applications where a large cooling capacity is required, such as in laser systems or DC-DC converters.
The working principle of the ATS-20C is quite simple. When the heat source is connected to the heat sink, the heat is conducted through the aluminum base plate and into the extruded aluminum fins. The fins then act as a thermal buffer and dissipate the heat away from the source. This enhances the thermal management of the system, greatly improving its overall performance.
The ATS-20C is an extremely efficient thermal solution for a wide variety of applications. Its capabilities in dissipating heat quickly and efficiently make it an ideal choice for any application requiring effective thermal management. Additionally, its design is highly modular, making it easy to install and tune to specific thermal requirements.
The specific data is subject to PDF, and the above content is for reference