ATS-20C-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20C-10-C3-R0-ND

Manufacturer Part#:

ATS-20C-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20C-10-C3-R0 datasheetATS-20C-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices used to dissipate heat generated in electronic components by increasing the surface area of a component, thus aiding in heat dissipation. The ATS-20C-10-C3-R0 heat sink is used in a variety of applications to provide effective thermal management. This article will discuss the application fields of the ATS-20C-10-C3-R0 heat sink and its working principle.

The ATS-20C-10-C3-R0 heat sink is a cost-effective solution for a variety of applications. It is an aluminum extruded heat sink with a natural anodized finish that provides superior thermal conductivity. It is suitable for applications where high thermal efficiency is required, such as medical imaging systems, motor controls, LED lighting, and LED driver assemblies. The ATS-20C-10-C3-R0 is also suitable for applications that generate higher power, such as processors and power transistors.

The ATS-20C-10-C3-R0 heat sink features efficient heat dissipation, high thermal conductivity, and excellent corrosion resistance. It is also designed to be easy to install and can be used with a variety of mounting hardware. The ATS-20C-10-C3-R0 is also constructed using anodized aluminum to offer superior electrical conductivity and increased heat dissipation.

The working principle of the ATS-20C-10-C3-R0 heat sink is simple. Heat generated by the component is absorbed by the heat sink and dissipated away from the component. This is achieved by utilizing the process of conduction, where the heat is transferred from the hotter component to the cooler heat sink. The thermal efficiency of the heat sink greatly depends on its design and surface area. The larger the surface area of the heat sink, the greater the amount of heat it can dissipate away from the component.

In conclusion, the ATS-20C-10-C3-R0 heat sink is a cost-effective solution to a variety of applications. It is suitable for applications where high thermal efficiency is required, such as medical imaging systems, motor controls, LED lighting, and LED driver assemblies. The ATS-20C-10-C3-R0 is constructed using anodized aluminum to offer superior electrical conductivity and increased heat dissipation. It features efficient heat dissipation, high thermal conductivity, and excellent corrosion resistance. The working principle of the ATS-20C-10-C3-R0 heat sink is based on the process of conduction, where the heat is transferred from the hotter component to the cooler heat sink.

The specific data is subject to PDF, and the above content is for reference

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