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ATS-20C-100-C2-R0 Application Field and Working Principle

Thermal heat sinks are among the most common and important heat management devices used in applications requiring temperature stability and dependable thermal performance. The ATS-20C-100-C2-R0 heat sink is a particularly robust and reliable solution in the market. By providing a long-term and reliable thermal solution, the ATS-20C-100-C2-R0 has become one of the most popular choices for various applications ranging from mobile phones, laptop computers, digital TVs, server cabinets, to industrial control systems. This article will discuss the application field and working principle of the ATS-20C-100-C2-R0.

Application Field

The ATS-20C-100-C2-R0 can be used in small desktop computers, laptop notebooks, mobile phones as well as other consumer electronics that require a high degree of reliability with respect to temperature stability. This heat sink is also used in industrial control systems to dissipate heat generated from higher power components and devices.

Heat management is very important in consumer electronics and industrial control systems. The ATS-20C-100-C2-R0 is a highly reliable, low-cost solution to maintain the optimum temperature and ensure long-term reliability of the device or component. This versatile and powerful heat sink can dissipate even higher levels of heat achieved by components, such as CPUs, GPUs or FPGAs.

Working Principle

The ATS-20C-100-C2-R0 is a Fin Type heat sink. Fin Type heat sinks are most common in industry due to their robustness and easy installation. The working principle of this type of heat sink is based on the conduction of heat from the surface of a component to an area that is larger, therefore radiating heat away from the component quickly and efficiently.

The ATS-20C-100-C2-R0 utilises a copper baseplate with a high purity aluminium extrusion forming a fin stack. The fin stack is designed to create a large surface area for a large amount of air contact and improved heat dissipation. A heat transfer layer is applied in between the copper base and the fin stack to optimise the thermal transfer process from the surface of the component to the larger fin stack area. This layer provides an increased thermal resistance which increases the dissipation efficiency.

In addition, the ATS-20C-100-C2-R0 can be used in combination with a fan to further increase the thermal efficiency. This feature is particularly useful for applications that require higher levels of heat dissipation, such as industrial control systems. The fan is also key in ensuring an even distribution of airflow over the whole heat sink surface. This facilitates a more efficient and uniform heat dissipation from the fin stack.

Conclusion

The ATS-20C-100-C2-R0 is a reliable and powerful thermal heat sink suitable for applications requiring temperature stability and dependable thermal performance. This heat sink utilises a Fin-Type construction based on a copper baseplate and a high purity aluminium extrusion providing a large surface area for a large amount of air contact and improved heat dissipation. This temperature management device is also suitable to be used in combination with a fan for applications requiring higher levels of heat dissipation. In conclusion, the ATS-20C-100-C2-R0 is a highly reliable and cost-efficient heat sink solution for various applications.

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