| Allicdata Part #: | ATS-20C-104-C3-R1-ND |
| Manufacturer Part#: |
ATS-20C-104-C3-R1 |
| Price: | $ 4.55 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-104-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.09437 |
| 30 +: | $ 3.86715 |
| 50 +: | $ 3.63964 |
| 100 +: | $ 3.41221 |
| 250 +: | $ 3.18473 |
| 500 +: | $ 2.95725 |
| 1000 +: | $ 2.90037 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential part of any modern electronics system. From computers to cell phones, heat sinks help dissipate the heat generated from the electrical components to ensure that the device functions correctly and safely. The ATS-20C-104-C3-R1 is a thermal-heat sink designed specifically for computers and telecommunications applications.
The ATS-20C-104-C3-R1 is a compact and efficient heat sink made of aluminum extrusion. It has a low thermal resistance of 17.7°C/W, and is designed to dissipate thermal loads of up to 20 watts. It is well suited for use in high heat environments, such as server enclosures, telecom equipment, and other systems with high thermal loads.
The ATS-20C-104-C3-R1 has a harmonized split-fin design that maximizes the heat-sink’s air flow, allowing the heat to be quickly dissipated. It features an anti-slip surface, ensuring that the ATS-20C-104-C3-R1 is firmly mounted in the system and does not vibrate. The ATS-20C-104-C3-R1 also features a grooved surface, which allows for improved contact between the heat-sink and the device it is cooling.
The ATS-20C-104-C3-R1 operates by absorbing the heat generated by the electronic components and using that heat to conduct away the generated heat. This process is enabled by the material used in the ATS-20C-104-C3-R1. The aluminum extrusion on the ATS-20C-104-C3-R1 is the ideal material for heat-sink applications and is designed to facilitate effective heat transfer away from the hot components.
The ATS-20C-104-C3-R1 can be easily installed and requires minimal maintenance. It includes mounting hardware such as mounting screws, rubber washers, and adhesive pads. It also features a thermal adhesive and pre-applied thermal tape, ensuring that the ATS-20C-104-C3-R1 stays firmly in place without slipping or vibrating.
In conclusion, the ATS-20C-104-C3-R1 is a thermal-heat sink designed specifically for computers and telecommunications applications. It has a low thermal resistance of 17.7°C/W, and is designed to dissipate thermal loads of up to 20 watts. It is well suited for high-heat applications and comes with pre-installed mounting hardware for easy installation and maintenance.
The specific data is subject to PDF, and the above content is for reference