| Allicdata Part #: | ATS-20C-109-C1-R1-ND |
| Manufacturer Part#: |
ATS-20C-109-C1-R1 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-109-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.07169 |
| 30 +: | $ 3.84531 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are one of the oldest methods of dissipating heat from electronic components. In many cases, they are necessary for proper operation and longevity of the components. The ATS-20C-109-C1-R1 is a modern heat sink designed for use in applications requiring high efficiency thermal dissipation and high reliability in challenging installations.
The ATS-20C-109-C1-R1 is designed to handle a range of operating temperatures up to 160°C. It is constructed from a copper base and copper pins). These materials provide excellent thermal conductivity and resistance to corrosion. The pins also reduce noise from air movement through the heat sink.
The heat sink consists of two main components: the body and the fins. The body of the heat sink is constructed of extruded aluminum and features a profile that incorporates small channels to allow for optimal air flow, providing a larger effective cooling area with minimal airflow resistance. The fins are attached to the body of the heat sink and feature a 3-dimensional shape which provides a larger surface area for more efficient heat transfer.
The ATS-20C-109-C1-R1 also includes one large fan with three speed settings (low, medium and high). The fan is designed to provide the most efficient cooling solution possible, and its speed can be adjusted to match the specific cooling requirements of the application. In addition, the heat sink can be mounted on a variety of mounting surfaces, including PCBs, hard surfaces, and plastic.
The ATS-20C-109-C1-R1 is designed for use in applications like telecommunications, power supplies, motor control, and high-heat application that require a reliable and efficient heat sink. The device provides excellent cooling performance without compromising on size, providing an effective solution for applications where space is limited. It is also capable of withstanding high vibration and shock, making it ideal for use in extreme environments.
In terms of performance, the ATS-20C-109-C1-R1 boasts impressive thermal conductivity and durability. The heat sink is able to transfer heat quickly and efficiently away from the component, while also providing superior resistance to corrosion. As a result, the heat sink is able to provide reliable and reliable thermal performance for years.
The ATS-20C-109-C1-R1 is an excellent example of thermal heat sinks. It is designed to provide excellent thermal performance in a variety of applications, offering reliable cooling in high-heat, challenging environments. With its copper base and pins, its 3-dimensional fins and its adjustable fan, the ATS-20C-109-C1-R1 provides a reliable and efficient option for a variety of applications.
The specific data is subject to PDF, and the above content is for reference