| Allicdata Part #: | ATS-20C-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is the foundation of any electronic device, and the ATS-20C-117-C1-R0 heat sink is the perfect example of heatsink technology. This heat sink offers superior thermal conductivity, ensuring that the heat produced by an electronic device will be dissipated quickly and efficiently, without compromising the performance and longevity of the device. The ATS-20C-117-C1-R0 is a flexible heat sink solution, allowing it to be applied to any heat-dissipating application.
The ATS-20C-117-C1-R0 features a sophisticated blend of material sciences and thermodynamic engineering. This heat sink is composed of multiple metal layers, consisting of a thermally conductive core layer surrounded by a layer of highly conductive nickel-titanium product alloy. The core layer is designed to efficiently dissipate the heat generated by high-power electronic devices, while the nickel-titanium layer suppresses thermal resistance and ensures a thermal conductivity of the entire device.
The exterior of the ATS-20C-117-C1-R0 heat sink is comprised of a die-cast alloy, while its interior is composed of a highly conductive aluminum alloy. This combination of materials ensures that the heat sink performs to the highest industry standards, while providing optimal heat transfer. The alloy composition of ATS-20C-117-C1-R0 also provides a high level of vibration and shock absorption, adding to the overall efficiency of the product.
The ATS-20C-117-C1-R0 is designed with a variety of mounting mechanisms, allowing it to be easily applied to a wide range of components and hardware configurations. It can easily be attached to a motherboard, a space-saving electronic component, or a heat-generating piece of equipment. The mounting mechanisms allow for easy accommodation of a variety of form factors, including DIN- and VESA-compliant sizes.
The ATS-20C-117-C1-R0 also features a number of unique design elements, such as an ergonomic clip-assembly for facilitating the installation of the device, as well as a special enclosure to improve the dissipation efficiency of the heat sink. Additionally, its advanced heat dissipating surfaces ensure that the heat is transferred quickly and efficiently to the atmosphere, preventing the excessive buildup of heat in the surrounding environment.
The ATS-20C-117-C1-R0 is an effective and reliable heat sink, designed to provide superior thermal performance in a wide variety of applications. Its unique combination of advanced material sciences and thermodynamic engineering enables it to dissipate heat quickly and efficiently, without compromising the performance and longevity of the device. This makes it an ideal choice for any application where thermal management is essential.
The specific data is subject to PDF, and the above content is for reference