ATS-20C-121-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-20C-121-C3-R0

The ATS-20C-121-C3-R0 is a thermal-heat sink which is used for cooling of electronic components in order to prevent heat-related failure. This type of heat sink is used in many applications, including industrial, medical, power generation, and automotive purposes.

Application Field

The ATS-20C-121-C3-R0 is suitable for applications where the component must dissipate heat away from sensitive components. It is ideal for applications where high power densities and high junction temperatures are involved, as it provides an effective way to reduce temperature and help to avoid overheating and premature failure of equipment. The ATS-20C-121-C3-R0 also provides fast thermal response and excellent temperature uniformity, which makes it suitable for a variety of applications. For industrial applications, the ATS-20C-121-C3-R0 is typically used to hold and cool sensitive electronics while protecting them from extreme temperatures. It can also be used in commercial and military communications systems, where it protects electronic components from overheating and damaging effects of vibration and shock. In medical applications, heat sinks are typically used to control the temperature of electrical components in order to protect patients from burns. In the automotive world, thermal-heat sinks are used to keep the vehicle’s components and engine cool to ensure a smooth running operation. In power generation, these devices are used to control and manage high power flows, as well as increase efficiency in operations.

Working Principle

The ATS-20C-121-C3-R0 thermal-heat sink uses the thermal-convection design principle to move heat away from sensitive components. This type of heat sink is designed to maximize thermal conduction, allowing the heat from electronic components to be transferred quickly away from the component. The ATS-20C-121-C3-R0 is typically mounted to the electronic component, and heat is spread across the heat sink surface, then away through the air or another liquid. Heat is transferred from the component to the heat sink via a combination of conduction and convection. Heat conduction involves the transfer of heat from one material to another material touching it, while heat convection involves the transfer of heat from hot spots to colder areas due to the movement of air, liquid, or particles touching the surface of the component. Thermal-convection heat sinks also use the principle of dissipation to reduce the temperature of components. When a heat sink is designed to absorb and dissipate heat, the air temperature around the component is lowered, dissipating heat away from the component. This process is aided by air flow, and some heat sinks may also contain fins that help to increase the area of surface area exposed to the air.

Conclusion

The ATS-20C-121-C3-R0 thermal-heat sink is an effective way to reduce temperatures and keep vital electrical components from overheating, preventing failure and even potential harm from the devices they are used in. This type of thermal-heat sink is suitable for a variety of applications, and its superior design offers excellent thermal conduction and dissipation.

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