| Allicdata Part #: | ATS-20C-125-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-125-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-125-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are a type of thermal dissipation system used to cool electronic components. The ATS-20C-125-C1-R0 heat sink is a specific model of such a system. It is widely used as a cooling system for high-performance CPUs, GPUs, and other components, such as system boards and backplane devices.
The ATS-20C-125-C1-R0 is a thermal heat sink solution designed to provide excellent thermal performance in a wide range of applications, including industrial, consumer, and automotive. It implements a “pot fin” heat sink design, which allows for effective heat dissipation and long-term durability. The pot fin design also allows the ATS-20C-125-C1-R0 to accommodate a wide variety of components, including CPUs, GPUs, system boards, and backplane devices. The heat sink is also capable of dissipating power dissipation levels of up to 500 watts.
The ATS-20C-125-C1-R0 is capable of working at temperatures ranging from -40 to +150 degrees Celsius, making it suitable for use in many applications. The heat sink uses a closed loop water-cooled system to transfer heat away from components and circulate coolant throughout the entire system. The ATS-20C-125-C1-R0 features a compact housing that is able to fit into tight spaces and provides superior thermal performance over single-component solutions. The heat sink also has an integrated fan for cooling, which helps to draw in air and circulate it throughout the system.
The ATS-20C-125-C1-R0 has a number of features that make it particularly well suited for use in many systems. It has a greatly improved cooling performance over traditional thermal management solutions, and its closed loop water cooling system allows it to dissipate more heat in less time. It also features a longer life cycle than most thermal management solutions, as it is designed to withstand the rigors of repeated exposure to high temperatures. In addition, the ATS-20C-125-C1-R0 is certified to meet a variety of industry standards, including RoHS and WEEE.
The ATS-20C-125-C1-R0 is an efficient and reliable thermal management solution for a wide variety of applications and components. It is capable of effectively cooling high-performance CPUs, GPUs, system boards, and backplane devices, all while maintaining an extended life cycle. With its low-profile housing and fan-assisted cooling technology, the ATS-20C-125-C1-R0 is an ideal solution for thermal management in today’s world.
The specific data is subject to PDF, and the above content is for reference