ATS-20C-126-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.54°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:

The ATS-20C-126-C3-R0 is a thermal heat sink, which is used to dissipate heat generated by electronic components. This product can dissipate heat from a wide range of products, ranging from integrated circuits to power electronics. This thermal heat sink is engineered for superior performance and reliability with minimal energy consumption, and it provides superior thermal conductivity compared to other heat sinks on the market.

Application Field:

The ATS-20C-126-C3-R0 thermal heat sink is designed for a variety of applications in different industries. It can be used to dissipate excess heat from many electronics components and systems such as: power electronics, telecommunications, consumer electronics, automotive electronics, and military and aerospace systems. It is also suitable for industrial and medical applications.In the power electronics sector, the ATS-20C-126-C3-R0 thermal heat sink can be used to dissipate heat from high-efficiency switching power supplies, DC/DC converters, AC/AC converters, and AC/DC inverters. In telecommunications, it can be used for base stations, optical nodes, and access points. In the medical and automotive sectors, it can be used for heat dissipation in displays, lights, and other components.

Working Principle:

The ATS-20C-126-C3-R0 thermal heat sink utilizes the principle of thermal expansion and contraction to effectively dissipate heat. This is accomplished by using an aluminum heat sink that consists of multiple narrow fins arranged in layers on top of each other to form a heat sink wall. The aluminum material of the heat sink wall is highly thermally conductive, which enables heat to be transferred quickly from the component being cooled to the outer surface of the heat sink wall.The targeted component being cooled is attached to the inner finned surface of the heat sink wall, which causes the heat from the component to be absorbed and transferred to the outer surfaces of the heat sink wall. The heat is then dissipated by air or other fluid passing over the outside of the heat sink wall. The air or fluid cooling medium causes the aluminum material to heat up, leading to thermal expansion and contraction of the heat sink wall that helps remove the heat from the component. Thermal expansion and contraction of the heat sink wall will also help to reduce the chance of stress from being applied to the component or to the heat sink itself, as it reduces the impact of the temperature variation on the component and heat sink.

Conclusion:

The ATS-20C-126-C3-R0 thermal heat sink provides outstanding performance and reliability in a wide range of applications. This heat sink is designed to dissipate heat from multiple electronic components, including high-efficiency switching power supplies, DC/DC converters, AC/AC converters, and AC/DC inverters, as well as from telecoms base stations, optical nodes, and access points. The heat sink is especially suited for applications in the automotive, medical, and telecommunications industries. The heat sink utilizes thermal expansion and contraction to quickly dissipate heat from a targeted electronic component, and it provides excellent thermal conductivity and resistance to thermal stress, making it one of the best thermal heat sinks on the market.

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