| Allicdata Part #: | ATS33172-ND |
| Manufacturer Part#: |
ATS-20C-127-C2-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-127-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.12650 |
| 10 +: | $ 4.01373 |
| 25 +: | $ 3.79058 |
| 50 +: | $ 3.56769 |
| 100 +: | $ 3.34473 |
| 250 +: | $ 3.12175 |
| 500 +: | $ 2.89877 |
| 1000 +: | $ 2.84303 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-127-C2-R0 is part of the family of thermal - heat sinks that is designed to help manage the heat generated from many electrical components. This particular heat sink is used in many applications and has become one of the most popular in the market today. The device functions by dissipating heat, allowing the temperature of the component to stay within its safe operating range.
The ATS-20C-127-C2-R0 is designed to be mounted on the component\'s board and connected to the component through solder joints. Its goal is to dissipate heat in an efficient manner and is highly effective at doing so. The device can draw heat away from the component with ease and give the opportunity to increase output and performance. The device is also suited for use in a wide range of environments, making it highly recommendable.
The working principle of the ATS-20C-127-C2-R0 is that it draws heat from the component by increasing the device\'s temperature. This increase causes the heat to be dissipated to the surrounding area, which keeps the component at an optimal temperature and avoids component failure. The heat sink\'s fins are designed to help dissipate the heat and allow the device to reach optimum performance.
The ATS-20C-127-C2-R0 is designed for many different applications, making it applicable in many different situations. It is highly effective in controlling the temperature of components in a wide range of industries, ranging from consumer electronics to industrial applications. The device is equipped with a low-profile design, which allows for a wide range of installation options and makes it suitable for multiple platforms.
The ATS-20C-127-C2-R0 is a great option when it comes to managing temperature and is highly effective in meeting the needs of many different applications. This heat sink provides an efficient and reliable way to dissipate heat and maintain peak performance of components. It is a highly recommended device for many different applications and is sure to provide great results.
The specific data is subject to PDF, and the above content is for reference