| Allicdata Part #: | ATS-20C-13-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-13-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-13-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19032 |
| 30 +: | $ 3.10380 |
| 50 +: | $ 2.93139 |
| 100 +: | $ 2.75902 |
| 250 +: | $ 2.58656 |
| 500 +: | $ 2.50034 |
| 1000 +: | $ 2.24169 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a critical component used to cool electronic devices. The ATS-20C-13-C1-R0 is a heat sink designed to manage temperatures across a wide range of applications. This article will discuss the application field and working principle of this product.
The ATS-20C-13-C1-R0 is specifically designed for cooling industrial electronic products, such as inverter drives, power controllers, transformers, and electronic ballasts. This product is often used with high current devices, due to its large surface area and efficient cooling performance. Additionally, this heat sink is made from high-grade aluminum, which ensures durability and corrosion-resistance, even in the harshest environments.
The main principle of the ATS-20C-13-C1-R0 is based on thermal-based cooling. When an electronic device is heated, the heat is transferred through the aluminum heat sink body and dissipated to the external environment. This process of exchanging heat between the device and the environment is known as heat conduction. This thermal-based cooling process ensures that the device runs at efficient temperatures, while also preventing overheating and protecting components from damage.
Apart from heat conduction, the ATS-20C-13-C1-R0 is also equipped with efficient cooling fans. These fans are used to further decrease the temperature of the device by helping draw away the heat. This is accomplished through the use of airflows that reduce heat buildup and improve air circulation. This increased airflow helps control temperatures and keeps the device running efficiently.
In addition, this heat sink is also designed with advanced heat dissipation technology. Advanced heat sinks on this device feature special heat flow channels that allow air to flow more easily through the fins and provide better heat dissipation performance. These heat sinks are also optimized for specific voltage ranges, depending on the application, which ensures optimal and reliable performance.
The ATS-20C-13-C1-R0 is an effective and reliable heat sink for cooling industrial electronic devices. Its thermal-based cooling and efficient fan system help to keep electronic devices running at optimal temperatures, while supporting high current operations. In addition, the advanced heat dissipation technology and voltage optimization allows this product to achieve maximum heat dissipation performance and reliability.
The specific data is subject to PDF, and the above content is for reference