| Allicdata Part #: | ATS-20C-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-137-C3-R0 thermal heat sink is a fundamental component in the field of thermal management. It efficiently dissipates heat and provides efficient cooling capability for a wide variety of electronic systems. The ATS-20C-137-C3-R0 utilizes a finned design that increases surface area and efficiently conducts heat away from the component being cooled. This thermal heat sink is a forced convection cooled, aluminum-finned construction heatsink that has been designed for a variety of uses in industrial, military, and aerospace applications.
The ATS-20C-137-C3-R0 is a thermal heat sink composed of an extruded aluminum base with a series of aluminum fins designed to increase surface area for efficient cooling. This thermal heat sink is designed to provide reliable cooling performance at temperatures up to 175°F. Additionally, the ATS-20C-137-C3-R0 features high thermal conductivity and is corrosion resistant.
The working principle of the ATS-20C-137-C3-R0 thermal heat sink is based on forced convection cooling. In this type of cooling, an air stream is forced onto the device and heat is transferred from the device to the fins. The air stream carries the heat away from the device and dissipates it into the surrounding environment. This type of heat sink is most efficient when the air stream has a high velocity, since this allows for maximum heat transfer.
The ATS-20C-137-C3-R0 thermal heat sink is suited for a wide range of industrial, military and aerospace applications. It can be used to cool CPUs, LEDs, transistors, and other types of electronic components. Additionally, it is designed to handle high vibration and shock applications, such as those found in avionics and jet engines. The ATS-20C-137-C3-R0 is also suitable for cooling a variety of IC packages, including those in plastic, ceramic-metal, and plastic-metal hybrid packages.
This thermal heat sink can be mounted either directly to the component to be cooled, or to the chassis of the system to provide additional support. One advantage of mounting the heat sink directly to the component to be cooled is that it eliminates thermal resistance from the component to the heat sink. This improves overall cooling efficiency. Additionally, the ATS-20C-137-C3-R0 thermal heat sink also has anodized aluminum alloy for resistance to corrosion and oxidation.
In summary, the ATS-20C-137-C3-R0 is an efficient thermal heat sink that can be used in a variety of industrial, military, and aerospace applications. It is composed of an extruded aluminum base with a series of aluminum fins that increase surface area for efficient cooling. The ATS-20C-137-C3-R0 utilizes a forced convection cooling principle and is designed to handle high vibration and shock applications. Additionally, it has anodized aluminum alloy for resistance to corrosion and oxidation.
The specific data is subject to PDF, and the above content is for reference