| Allicdata Part #: | ATS-20C-14-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-14-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-14-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20C-14-C3-R0 is a thermal-heat sink module designed to offer reliability and performance while allowing for the most compact module size. It is a cutting-edge thermal-heat sink solution for devices with high thermal loads. The ATS-20C-14-C3-R0 is ideal for use in highly dense and highly loaded application fields including power electronics, LED lighting, power system, consumer electronics, and so on.
The ATS-20C-14-C3-R0 offers a unique solution in its ability to handle high thermal loads in a small module size. The ATS-20C-14-C3-R0 comes in a range of sizes and configurations to fit into any application. Additionally, its robust construction and high-end materials provide superior ability to handle thermal loads and ensure consistent performance.
The ATS-20C-14-C3-R0 module features high thermal efficiency with an advanced wind tunnel-based design. This design creates efficient air circulation, enabling the absorption of heat generated from the device. The module allows the device to reach lower operating temperatures by quickly dissipating the heat generated by the device. The ATS-20C-14-C3-R0 also features superior cooling performance with its patented forced air system, which increases airflow while reducing noise and thermal resistance.
The high-end materials used in the construction of the ATS-20C-14-C3-R0 offer superior thermal properties. The heat sink is made from highly thermally conductive alloys, which help reduce thermal resistance and ensure an uniform heat transfer. The high-end alloy construction of the ATS-20C-14-C3-R0 is highly corrosion-resistant and durable, ensuring long-term performance.
The ATS-20C-14-C3-R0 module is easy to install and maintain. Its unique design allows for quick and easy installation, without the need for complicated tools. The ATS-20C-14-C3-R0 is also easy to maintain, as it features a user-friendly design and requires minimal servicing.
The ATS-20C-14-C3-R0 module offers superior performance in a variety of application fields. Its advanced design enables it to be used in applications ranging from consumer electronics to power systems. It is ideal for use in applications that require high thermal loads, such as power electronics, LED lighting, and power system. The ATS-20C-14-C3-R0 is also suited for use in applications that require efficient thermal management, such as computers and gaming consoles.
The ATS-20C-14-C3-R0 module offers a reliable and efficient solution for thermal-heat sink applications. Its advanced design and high-end materials ensure superior performance while allowing for the most compact module size. The ATS-20C-14-C3-R0 is the ideal solution for any application that requires efficient and reliable thermal management.
The specific data is subject to PDF, and the above content is for reference