| Allicdata Part #: | ATS33188-ND |
| Manufacturer Part#: |
ATS-20C-141-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-141-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of electronic systems, ensuring that individual components are safely operated and providing reliable and efficient performance. Heat sink devices are widely used in various industries to effectively dissipate heat from components, often using a combination of airflow and cooling devices. The ATS-20C-141-C2-R0 is a high-performance heat sink, suitable for application in numerous industrial applications.
The ATS-20C-141-C2-R0 is a highly efficient and reliable option to dissipate heat from components without requiring any additional air flow. This device contains two separate heatsink plates to ensure efficient cooling and is constructed of a robust aluminum-silicon alloy for maximum strength. The ATS-20C-141-C2-R0 utilizes a patented air flow technology to achieve excellent heat dissipation, eliminating the need for an additional cooling device. This technology allows the device to provide greater cooling protection and more reliable performance for a wide range of applications.
The ATS-20C-141-C2-R0 is suitable for use in a wide range of industrial applications, including automotive, medical, industrial control, computer and telecommunications. This device provides excellent thermal properties, including high-performance heat transfer and an impressive coefficient of thermal conduction. The ATS-20C-141-C2-R0 is designed to reduce electron temperature by up to 30%, ensuring reliable and efficient performance for a wide range of applications.
The working principle of the ATS-20C-141-C2-R0 involves two main processes. Firstly, the aluminum-silicon alloy heatsink plates draw heat away from the electronic components and dissipate it into the air via the patented air flow technology. Secondly, as the air passes over the heatsink plates, air borne particles generated by the air flow create a cooling effect, further reducing the operating temperature of the components.
The ATS-20C-141-C2-R0 provides excellent performance when used in conjunction with other cooling systems. Its high performance design ensures effective cooling protection while it\'s reliability makes it an ideal choice for various industrial applications. The ATS-20C-141-C2-R0 is a highly recommended thermal management solution for industrial applications where reliable and efficient cooling is a necessity.
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