| Allicdata Part #: | ATS-20C-147-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-147-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-147-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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As the need for efficient heat dissipation increases, thermal material selection is becoming more important. The ATS-20C-147-C3-R0 is a heat sink specifically designed to efficiently transfer heat away from CPU devices. It is an ideal heat management solution for applications ranging from laptops to servers.
ATS-20C-147-C3-R0 is a one-piece aluminum extruded solution, which can transfer up to 20W of heat. It has an extruded fin structure that creates a larger surface area to enhance its heat conduction ability. The fin pattern is connected with a heat pipe, which is further connected to a bottom plate. It dissipates the heat faster than traditional heat sinks, due to the enhanced thermal conductivity. The design of the heat pipe is optimized to ensure that the temperature remains uniform across the entire heat sink.
In addition, the ATS-20C-147-C3-R0 heatsink boasts a high resistance to temperatures up to 150°C. Its fin pattern also improves its performance under high-pressure requirements, making it ideal for applications that require intensive cooling. It also features a thermal capacity of up to 20W, making it suitable for a range of industry applications such as gaming computers and servers.
The working principle of the ATS-20C-147-C3-R0 heat sink is based on the principles of thermodynamics. The fin structure of the heat sink creates a large amount of surface area, which enables the heat from the device to be transferred efficiently away from the device. The heat pipe connects the fin structure to the bottom plate and transports the heat away from the device. The heat pipe dissipates the heat via conduction, which effectively prevents the heat from being transferred back into the device.
Although the ATS-20C-147-C3-R0 heat sink is primarily designed for CPUs, it can also be used for other applications that require efficient cooling. It is suitable for any type of application that requires high thermal transfer capacity and efficient heat dissipation. It is also cost-effective, as it is simple to install and requires no assembly. Furthermore, it is lightweight and therefore easier to maneuver, making it an ideal choice for the modern cooling market.
The ATS-20C-147-C3-R0 is a reliable and cost-effective cooling solution for the modern market. Its optimized design ensures efficient heat transfer capacity, thereby ensuring that it can effectively cool any type of electronic device. Its fin pattern also improves its performance, making it ideal for any industry application. The setup of the heat pipe also prevents the heat from being re-introduced into the device, thus ensuring that the device remains cool under all conditions.
The specific data is subject to PDF, and the above content is for reference