| Allicdata Part #: | ATS-20C-149-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-149-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-149-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29910 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of modern electronics. Heat sinks are one of the most common methods used to dissipate heat from a device and help keep its temperature inside the required operational level. The ATS-20C-149-C3-R0 is a thermal-heat sink designed for the purpose of cooling of integrated circuits and other electronic components.
The ATS-20C-149-C3-R0 is a heat sink manufactured by Aavid Thermal Technologies. It is a copper heat sink with a light weight aluminum fins and cooling base assembly, and offers an excellent thermal management solution that is perfect for any application that requires a high thermal performance. It works by providing a surface area that is large enough to dissipate heat away from the heat source, and also by providing a larger cooling area, which will allow the heat to dissipate more quickly.The fins are designed in a unique pattern which allows for more efficient cooling airflow, resulting in a much more efficient heat transfer.
The main application field for the ATS-20C-149-C3-R0 heat sink is in high performance, power electronics where the thermal dissipation requirements are quite high. These components can experience sudden and high temperature changes, and the heat sink helps prevent arching or short circuits from occurring. The ATS-20C-149-C3-R0 ensures that the temperature of these components remain within the operational range and prevent any damage that can occur due to overheating of the components.
The other application field for the ATS-20C-149-C3-R0 heat sink is in cooling of devices which include high-speed processors, video cards, high-current power supplies, voltage regulators, and other heat sensitive devices. The ATS-20C-149-C3-R0 is a robust thermal solution, which ensures stability of temperature in these applications, and also provides a long service life.
The working principle of the ATS-20C-149-C3-R0 heat sink is based on the principle of thermal conduction. When a heat source is subjected to a heat sink, the heat is transferred from the source to the sink with the aid of a thermal interface material such as thermal compound or thermal tape. The thermal compound contains a liquid which acts as a reservoir of heat, while the thermal tape acts as a thermal bridge, helping to conduct heat from one surface to the other. Once the heat is conducted through the thermal interface, it is then dissipated through the fins and cooling base of the heat sink.
The ATS-20C-149-C3-R0 is a highly effective and reliable thermal solution for various types of applications that require a high thermal performance. It is designed to offer an efficient cooling solution for integrated circuits and other electronic components, preventing any overheating and arching or short circuit risks. This robust heat sink is an excellent way to keep the components running at their optimal operating temperature, and ensuring a long service life.
The specific data is subject to PDF, and the above content is for reference