| Allicdata Part #: | ATS-20C-151-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-151-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-151-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat generated by electronic components. They are often used in dynamic applications like high power transistors, high power diodes, and power transistors. Heat sinks are typically made from aluminum or copper and have a number of fins, either joined or separated, to increase the surface area. Heat sinks are also used in many other applications including optical amplifier and power supply applications.
The ATS-20C-151-C1-R0 is a heat sink specifically designed for applications such as high-power transistors and circuits. It is a professional grade thermal management device that incorporates an advanced pin-fin design. This design dramatically increases the dissipation rate of heat generated from the power transistors. The pin-fin design has been rigorously tested and is therefore proven to be the most efficient design for dissipating heat.
The ATS-20C-151-C1-R0 features a combination of aluminum and copper to maximize thermal conductivity and strength. It is designed to provide the highest level of cooling performance in power circuit applications. The pin-fin design provides increased surface area for maximum heat dissipation while also allowing for low-profile construction.
The heatsink comes with two mounting options: surface mount and through-hole mount. The surface mount option has a special design that enables the heatsink to be installed on the surface of the board. This mounting option allows for easy and secure installation. The through-hole mount utilizes the existing hole pattern on the board and provides a secure mounting solution. Both options are designed to provide the highest level of cooling performance for any application.
In operation, the ATS-20C-151-C1-R0 works by the principle of convection. This involves drawing heat away from the heated component by passing a thermal fluid, such as air, over the heatsink. This creates a current of air that effectively dissipates the heat away from the component. This type of thermal management is highly effective and is used in many industrial applications.
The ATS-20C-151-C1-R0 is the perfect choice for applications requiring a high level of heat dissipation. It offers superior cooling performance and is built to stringent quality standards. The advanced pin-fin design provides increased surface area for maximum heat dissipation, and the integrated mounting options allow for easy and secure installation. With its combination of aluminum and copper, the ATS-20C-151-C1-R0 is one of the most reliable and efficient thermal management solutions available.
The specific data is subject to PDF, and the above content is for reference