| Allicdata Part #: | ATS-20C-156-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-156-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-156-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37869 |
| 30 +: | $ 3.28713 |
| 50 +: | $ 3.10451 |
| 100 +: | $ 2.92188 |
| 250 +: | $ 2.73927 |
| 500 +: | $ 2.64797 |
| 1000 +: | $ 2.37404 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical component in any electronics application, and heat sinks are essential components for effective thermal management. The ATS-20C-156-C1-R0 heat sink is a commonly used component for cooling high-performance systems and devices. This article provides an overview of the ATS-20C-156-C1-R0 heat sink application field and working principle.
The ATS-20C-156-C1-R0 is a low profile heat sink designed for active cooling of small and medium power components. It is ideal for use in small spaces and tight confines in consumer electronic devices such as media players and routers. Its size is ideal for installation in these applications. The heat sink has an extended base section with a streamlined profile and integrated fins that provide improved cooling effectiveness and performance. It features a unique fin morphology that is designed to maximize the thermally conductive surface area.
ATS-20C-156-C1-R0 is constructed with aluminum alloy which allows for excellent thermal conductivity. The heat sink is designed with a black anodized finish that provides superior corrosion and wear resistance. The aluminum alloy is also lightweight and cost-effective. The base section is fit with numerous mounting holes to enable the heat sink to be securely mounted on various devices.
The working principle of the ATS-20C-156-C1-R0 is simple and straightforward. Heat from a component or device is transferred to the heat sink via thermal interface materials or direct contact. Once the heat is transferred to the heat sink, convection of air currents facilitates the dissipation of the heat away from the heat sink. The aluminum alloy construction of the heat sink provides an effective mechanism for thermal transfer and dissipation.
The ATS-20C-156-C1-R0 is a reliable and efficient heat sink suitable for cooling a variety of devices and applications. It offers excellent thermal performance at an affordable price. With its low profile design and thermal characteristics, it is an ideal choice for cooling consumer electronic devices and other small and medium-power applications that require effective thermal management.
The specific data is subject to PDF, and the above content is for reference