| Allicdata Part #: | ATS-20C-158-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-158-C1-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-158-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45870 |
| 30 +: | $ 3.26676 |
| 50 +: | $ 3.07465 |
| 100 +: | $ 2.88244 |
| 250 +: | $ 2.69027 |
| 500 +: | $ 2.49811 |
| 1000 +: | $ 2.45008 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-20C-158-C1-R0 heat sink is a type of thermal management device that is designed to provide cooling for electronic components and systems. Heat sinks use a combination of convection, radiation, and conduction to dissipate the heat generated by the components or systems.
The ATS-20C-158-C1-R0 heat sink is composed of an aluminum base plate, aluminum fins, and several screw-on heatsink clip assemblies. The fins are stepped in design and are designed to increase the surface area for improved heat dissipation. The fins are also serrated to promote air flow. The screws and clips are used to secure the heatsink to the component or system.
The primary purpose of a heat sink is to enhance the cooling efficiency of an electronic component or system. Heat sinks work by increasing the surface area of the component or system. As the surface area increases, more heat can be dissipated from the component or system. Heat sinks also work by improving air flow around the component or system, allowing the air to better carry away the heat from the component or system.
Heat sinks can be used in a variety of applications. They are commonly used to cool CPUs, GPUs, video cards, hard drives, and other components that generate a lot of heat. They are also used to cool PC motherboards, server systems, communications systems, and other electronics systems that need to maintain a cool operating temperature.
Heat sink manufacturers typically provide a fan, fan clip, or fan bracket with the heat sink. The fan is used to further improve the cooling efficiency of the heat sink. The fan is typically attached to the heatsink using the provided fan clip or fan bracket. The fan blows air through the fins of the heat sink, which helps to dissipate the heat more quickly. The fan also helps to circulate the air around the components or systems, further improving their cooling efficiency.
The ATS-20C-158-C1-R0 heat sink is a high-efficiency thermal management device that is designed to provide effective cooling for a wide variety of electronic components and systems. The heat sink is composed of a base plate, fins, and screw-on heatsink clip assemblies. The fins are stepped in design and serrated to promote air flow. The heat sink is typically used with a fan to further improve its cooling efficiency. Heat sinks are commonly used to cool CPUs, GPUs, video cards, hard drives, PC motherboards, server systems, and communications systems.
The specific data is subject to PDF, and the above content is for reference