| Allicdata Part #: | ATS-20C-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-16-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.20166 |
| 30 +: | $ 3.11535 |
| 50 +: | $ 2.94223 |
| 100 +: | $ 2.76917 |
| 250 +: | $ 2.59610 |
| 500 +: | $ 2.50957 |
| 1000 +: | $ 2.24995 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of modern electronic systems, and heat sinks are an important component of this facet. The ATS-20C-16-C1-R0 is a thermoelectric heat sink designed to efficiently dissipate heat away from electronic components, helping to improve the system’s reliability and longevity.
The ATS-20C-16- C1-R0 is a compact, aluminum-based heat sink. It has a housing made of powder-coated steel and anodized aluminum, which provides a better surface area for heat dissipation than a conventional aluminum heat sink. The internal structure of the ATS-20C-16-C1-R0 consists of high quality copper fins that have been cold-pressed and skived for maximum heat dissipation. The interior of the heat sink is filled with high pressure air, which helps to improve the overall cooling performance.
The ATS-20C-16-C1-R0 is designed for use with a range of processor and other components, including Intel Xeon, AMD Ryzen, and Intel Core processors. It provides a reliable, low-noise solution for those who need to dissipate heat from their systems. The ATS-20C-16-C1-R0 is also compatible with many other electronic components such as resistors, capacitors, and voltage regulators.
The ATS-20C-16-C1-R0 is well-suited for use in various industries, including telecommunications, aerospace, automotive, and medical. It is powerful enough to handle the most complex and demanding applications, and its durable construction help to guarantee its longevity. The ATS-20C-16-C1-R0 provides superior performance and reliability when compared to other thermal solutions, making it an ideal choice for various applications.
The working principle of the ATS-20C-16-C1- R0 relies on the thermoelectric effect. This effect describes the phenomenon in which heat is transferred from one material to another when an electric current is passed through them. This effect is used to move heat away from sensitive components in electronic systems. The ATS-20C-16-C1-R0 also has a number of features designed to improve the efficiency of this process. For example, a patented direct-contact heat-pipe technology ensures that heat is dissipated quickly and evenly across the system, improving its overall cooling performance and reliability.
The ATS-20C-16-C1-R0 is also equipped with a number of temperature sensors, which monitor the temperature of the system and provide feedback so that the thermal management system can adjust accordingly to ensure optimal performance. The sink is designed to remain both reliable and efficient even after long periods of continuous use.
Overall, the ATS-20C-16-C1-R0 is an advanced thermoelectric heat sink designed to provide reliable and efficient cooling solutions for a variety of applications. Its durable construction and advanced technology make it an ideal choice for a wide range of applications and industries.
The specific data is subject to PDF, and the above content is for reference