| Allicdata Part #: | ATS-20C-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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An ATS-20C-16-C3-R0 thermal solution is a device used primarily in electronics to keep inappropriate temperature levels from causing the equipment to overheat. It is a type of passive heatsink, meaning one that does not require any kind of active cooling such as a fan, and is a highly efficient and reliable temperature management solution. It belongs to the thermal-heat sinks product category of cooling solutions.
The ATS-20C-16-C3-R0 operates by dissipating heat away from the source, which is the container itself. In a properly sized enclosure, convective air currents within the container will draw heat away from the component and carry it to the outside of the box, where it will dissipate naturally. This is the same way that any heatsink functions, using air to draw away the thermal energy and dissipate it.
The ATS-20C-16-C3-R0 is made of aluminum or copper, both of which are highly thermally conductive materials. This greatly accelerates the dissipation of heat away from the component and outside of the enclosure. The aluminium version of the device also features fins which further increase the surface area of the device and by extension its capacity for dissipating heat.
In addition to being used as a passive cooling solution for components, the ATS-20C-16-C3-R0 is also used to protect electronic components from changes in temperature over time. It does this by acting as an insulator and keeping the component from being exposed to extreme temperature changes. This can be particularly beneficial for components such as microcontrollers, as components that can withstand extreme temperature changes are typically more expensive.
The ATS-20C-16-C3-R0 is also used to increase the life of components by limiting the temperature to a safe level. This, combined with protection against extreme temperature changes, allows components like motors and other electromechanical components to last much longer than they would without this type of device.
The ATS-20C-16-C3-R0 is available in both aluminium and copper versions. The aluminium version is generally the more economical choice, but the copper version offers better thermal conductivity and hence greater temperature control. Depending on the specific needs of the application, either version may be the most suitable choice.
In short, the ATS-20C-16-C3-R0 thermal solution offers a highly effective and reliable way of maintaining the temperature in an electronics system. It is an efficient and reliable temperature management solution for applications and due to its passive nature does not need any active cooling systems. With its high level of thermal conductivity, it is particularly well-suited for maintaining the temperature of both sensitive components and electromechanical components.
The specific data is subject to PDF, and the above content is for reference