ATS-20C-161-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20C-161-C3-R0-ND

Manufacturer Part#:

ATS-20C-161-C3-R0

Price: $ 4.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20C-161-C3-R0 datasheetATS-20C-161-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.96711
30 +: $ 3.74703
50 +: $ 3.52661
100 +: $ 3.30618
250 +: $ 3.08577
500 +: $ 2.86535
1000 +: $ 2.81025
Stock 1000Can Ship Immediately
$ 4.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are an important component of electronic products, providing thermal regulation and improved performance. The ATS-20C-161-C3-R0 is a specialized heat sink designed for use in a variety of applications. This article will discuss the application fields and working principle of the ATS-20C-161-C3-R0 thermal heat sink.

The ATS-20C-161-C3-R0 is designed to provide a maximum power dissipation of 20 Watts. It is noted for its compact nature – it measures just 161 mm in height – but makes its impact through its efficient thermal cycling capability and improved thermal regulation. This thermal heat sink can be effectively used in such application fields as power electronics, military electronics, telecom, and automation solutions.

The ATS-20C-161-C3-R0 works on the principle of forced convection cooling. The heat sink facilitates the removal of heat from the heat source area by directing the dissipation of the heat toward the environment. This is achieved through the use of a specially designed conduit that creates currents in the air, allowing for optimal and enhanced cooling. The thermal heat sink provides an excellent rate of heat exchange compared to other devices.

The ATS-20C-161-C3-R0 thermal heat sink is designed to use only two pins for electrical contact, which ensures easy mounting and reliable connectivity. The thermal contact resistance is extremely low, providing improved thermal performance and reliability. The heat sink is specifically designed to perform in elevated temperatures, ensuring continuous and reliable operation. The improved cooling capabilities are achieved through the use of advanced and high-grade aluminum cooling fins.

Additionally, the ATS-20C-161-C3-R0 comes with an integrated fan, allowing for further cooling and improved performance. The fan can be adjusted so that the right amount of air is supplied to the heat sink, allowing for optimum cooling. The fan also ensures that the lifespan of the heat sink is greatly extended, as it reduces the temperature gradient, thus reducing corrosion and wear.

The ATS-20C-161-C3-R0 thermal heat sink offers various advantages in comparison to other thermal devices. It features improved thermal performance, increased power dissipation, low thermal contact resistance, and a high rate of heat exchange. Furthermore, it is designed to be compact and easy to mount, as well as to operate in extreme temperatures. Finally, it comes with a built-in fan, ensuring reliable cooling and extended life.

The ATS-20C-161-C3-R0 thermal heat sink is an excellent choice for a number of different applications. With its advanced design, improved thermal performance, and extended life, it is ideal for use in power electronics, military electronics, telecom, and automation solutions. Companies can use this heat sink to reduce heat dissipation and improve performance of their products.

The specific data is subject to PDF, and the above content is for reference

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