| Allicdata Part #: | ATS-20C-163-C1-R0-ND |
| Manufacturer Part#: |
ATS-20C-163-C1-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-163-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47067 |
| 30 +: | $ 3.27768 |
| 50 +: | $ 3.08473 |
| 100 +: | $ 2.89202 |
| 250 +: | $ 2.69920 |
| 500 +: | $ 2.50639 |
| 1000 +: | $ 2.45818 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-20C-163-C1-R0 thermal-heat sinks are used extensively in a variety of applications and are particularly effective in controlling the heat produced by processors and electronics components. Thermal-heat sinks are designed to dissipate the heat generated by a system component, such as a processor, to the surrounding environment.
The ATS-20C-163-C1-R0 is constructed using aluminum and features finned extruded heat sink body. This specific heat sink model is designed to be mounted onto circuit boards, providing a low profile that is required for tight spaces. It also provides thermal conductivity and is designed to keep components cool while in operation. Additionally, its aluminum construction ensures durability and reliability.
The ATS-20C-163-C1-R0 thermal-heat sink works on the principle of convection. When the air circulation created by the fins of the heat sink comes into contact with a hot component, the heat is dissipated into the air and away from the electronics component. This process helps to keep the component at a cooler operating temperature. This process works best when the fins of the heat sink are able to move air efficiently.
The structure of the ATS-20C-163-C1-R0 thermal-heat sink is designed to ensure maximum heat transfer. The heat sink has fins that are extruded from an aluminum body, with tabs on the front and back to ensure secure mounting onto the circuit board. These fins allow for efficient heat transfer and provide an effective means for controlling the temperature of the system.
The ATS-20C-163-C1-R0 thermal-heat sink is designed to be used in many applications. It is particularly well suited for applications that require tight spaces and low profile product designs. Additionally, its aluminum construction makes it durable and dependable. It is the ideal choice for controlling heat produced by processors and components in any system.
In conclusion, the ATS-20C-163-C1-R0 thermal-heat sink is an effective way to keep processors and other components cool. Its construction allows for maximum heat transfer with minimal space, making it an ideal choice for tight spaces and low profile designs. Additionally, its aluminum construction ensures durability and reliability. This thermal-heat sink works on the principle of convection and is the perfect solution for controlling heat produced by processors and components in any system.
The specific data is subject to PDF, and the above content is for reference