ATS-20C-164-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-20C-164-C1-R0 Application Field and Working Principle

Heat sinks are an essential component in many electronic systems. They are used to dissipate heat generated by components such as microprocessors, power supplies, and other power electronic components, which can reduce the component temperature and prolong the service life of the component. ATS-20C-164-C1-R0 is a kind of heat sinks developed by AIC Technology Solutions. This article will discuss the application of ATS-20C-164-C1-R0 and its working principle.

Application

The ATS-20C-164-C1-R0 is designed to meet the requirements of a range of commercial and industrial applications. It is made up of corrosion-resistant steel sheet for superior long-term performance. It has an excellent capacity of thermal conductivity and radiation, making it ideal for use with high-power devices such as motor controllers, power converters, switching power supplies, amplifiers, and other similar components.The ATS-20C-164-C1-R0 has a low profile size and can be quickly and easily installed in a variety of environment. It can be used indoors and outdoors and allows for noiseless operation. Additionally, it is compatible with a wide range of products, which makes for easier installations and less expensive overall costs.

Working Principle

The ATS-20C-164-C1-R0 works through thermal conduction, which is the transfer of heat from one object to another through direct physical contact. In the context of a heat sink, this means that the heat generated by a component is transferred to the heat sink, thus dissipating the heat and reducing the temperature of the component and its surroundings.The ATS-20C-164-C1-R0 consists of an aluminum heat sink with a copper core. The heat sink is designed to provide a maximum surface area with which to conduct heat away from the component. The copper core, meanwhile, acts as an intermediary between the component and the heat sink, providing a conduit through which heat can travel more efficiently.The ATS-20C-164-C1-R0 is designed to provide excellent heat dissipation and cooling effects. Its aluminum fins are densely packed and highly efficient at convection-based heat dissipation, meaning that it can dissipate heat more effectively than a simple heatsink. Its copper core allows for better thermal conduction, allowing it to transfer heat more efficiently.The ATS-20C-164-C1-R0 is an ideal choice for applications where high power components or high temperatures are an issue. It can provide excellent cooling performance and is designed to provide maximum heat dissipation. Furthermore, its low profile size ensures it can be easily installed in a wide range of environments.

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