| Allicdata Part #: | ATS-20C-168-C3-R0-ND |
| Manufacturer Part#: |
ATS-20C-168-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20C-168-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of any electrical application or system. Heat sinks are essential components which help dissipate the heat from circuits and devices and help keep them running cool and efficient. The ATS-20C-168-C3-R0 is a heat sink that is engineered to provide non-conductive thermally conductive cooling for a variety of electronic devices.
The ATS-20C-168-C3-R0 is made up of a heat sink base and two heat spreaders. The base is constructed from an aluminum which has a high thermal conductivity and is composed of an extended length heat spreader for directing the heat away from the device. The heat spreaders have grooves which are designed to provide thermal balancing which helps avoid cold spots and to increase the overall performance of the heat sink. The heat spreaders are also designed to increase air flow to help dissipate the heat away from the device.
One of the most important features of the ATS-20C-168-C3-R0 is its compatibility with a wide variety of electronic devices. It can be used with a variety of LEDs, such as high power LEDs, as well as other devices such as optoelectronic detectors and light sources. It can also be used with CPUs, FPGAs, ASICs, high power motor drivers, and power logic ICs.
The ATS-20C-168-C3-R0 is designed to provide a low profile and a small footprint. This makes it an ideal choice for applications which require minimal space, as well as applications which require lower costs. The heat sink also features a screw mount design which allows for quick and easy installation, and the heat sink can be easily modified or replaced as required.
The ATS-20C-168-C3-R0 heat sink’s working principle is based on heat transfer. Heat is generated in the electronic device and this heat is dissipated through the heat sink base and spreaders. The heat is then transferred away from the device, allowing it to remain at a constant temperature and maintain optimal performance. The heat transfer rate depends on the thermal conductivity of the heat sink and the size and shape of the device.
The ATS-20C-168-C3-R0 is an excellent choice for applications which require reliable and efficient cooling. It is an ideal choice for a wide variety of LED, optoelectronic, and other electrical and electronic applications, due to its low profile, small footprint, and efficient cooling. With its low profile, it also provides an easy installation without any additional hardware, which keeps costs low.
The specific data is subject to PDF, and the above content is for reference